Preparation method of amino inhibited polyamide hot melt adhesive
A polyamide hot-melt adhesive and amine-based technology, applied in the direction of adhesives, etc., to achieve the effect of high peel strength
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Embodiment 1
[0016] Add 0.85 mol of sebacic acid, 0.87 mol of decane diamine, 0.45 mol of nylon 66 salt, 3.5 mol of caprolactam, 0.039 mol of hexadecylamine, and 1.72 g of phosphoric acid into the numerically controlled autoclave, constant pressure 1.65Mpa, constant pressure temperature 215℃ , After constant pressure reaction for 0.75h, release the pressure, the time to release to normal pressure is 1.1h, then pass N 2 Atmospheric pressure reaction for 0.75h and discharge to obtain product P1.
[0017]
Embodiment 2
[0019] Add 0.85 mol of sebacic acid, 0.952 mol of decane diamine, 0.65 mol of nylon 66 salt, 4.3 mol of undecalactam, 0.098 mol of dodecylamine, 3.44 g of tungstomolybdic acid, and constant pressure of 1.7Mpa into the numerically controlled autoclave. Constant pressure temperature 220℃, constant pressure reaction for 0.9h, then release pressure, release to normal pressure for 1.2h, then pass N 2 Atmospheric reaction for 0.8h and discharge to obtain product P2.
[0020]
Embodiment 3
[0022] Add 0.85 mol of sebacic acid, 0.89 mol of decanediamine, 0.5 mol of nylon 66 salt, 3.7 mol of caprolactam, 0.05 mol of octadecylamine, 1.94 g of hydrochloric acid, constant pressure 1.6Mpa, constant pressure temperature 200°C into the numerically controlled autoclave , After the constant pressure reaction for 0.5h, release the pressure, the time to release to normal pressure is 1.0h, then pass N 2 Atmospheric reaction for 0.5h and discharge to obtain product P3.
[0023]
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