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Infrared technology based wafer cutting online detecting system

A detection system, infrared technology, applied in the direction of working accessories, stone processing equipment, manufacturing tools, etc., can solve the problems of air cutting, blade wear, incomplete cutting, etc., to improve stability, ensure no damage, structure compact effect

Inactive Publication Date: 2014-01-22
NAT CENT FOR ADVANCED PACKAGING
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  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

[0002] When dicing wafers, the cutting machine will detect the knife marks online, but in order to meet the requirements of mass production, the cutting quality of the knife marks will be inspected every 20--30 steps (can be set), so it will cause the blade Empty cutting or incomplete cutting caused by severe wear during cutting

Method used

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  • Infrared technology based wafer cutting online detecting system
  • Infrared technology based wafer cutting online detecting system
  • Infrared technology based wafer cutting online detecting system

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Embodiment Construction

[0013] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0014] Such as figure 1 , figure 2 and image 3 As shown: in order to be able to detect the wafer cutting process in real time, to ensure that the wafer cutting is carried out normally and the cutting knife 4 is not damaged, the present invention includes a transmission shaft 6 and a flange 5 located at the end of the transmission shaft 6; An infrared sensor 7 for detecting the cutting line is also fixedly installed on the flange 5 .

[0015] Specifically, a cutting knife 4 is installed on the flange 5 , and a detection window 9 is provided at the emitting end of the infrared sensor 7 , and an air blowing device is provided in the detection window 9 . A wafer 3 is disposed below the dicing knife 4 , and the wafer 3 is disposed on the carrier plate 1 through the protective film 2 . The infrared sensor 7 can detect the dicing line when the dicing knife 4 cut...

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Abstract

The invention relates to a detecting system, particularly relates to an infrared technology based wafer cutting online detecting system and belongs to the technical field of wafer cutting detecting. According to the technical scheme, the system comprises a transmission shaft and a flange arranged at the end of the transmission shaft. An infrared sensor for detecting cutting ways is fixed on the flange. According to infrared technology based wafer cutting online detecting system, the infrared sensor is used for detecting the cutting ways of a cutting knife during cutting in real time, an infrared receiving circuit is used for receiving the wafer reflection wave amount, a signal amplification circuit and a filter circuit are used for inputting signals into a data processing circuit, and the data processing circuit is used for determining and controlling the working state of the cutting knife according to the wafer reflection wave amount. The system is compact in structure, high in detection instantaneity, capable of guaranteeing wafer normal cutting and guaranteeing the cutting knife against damage and improving the cutting stability and safe and reliable.

Description

technical field [0001] The invention relates to a detection system, in particular to an on-line detection system for wafer cutting based on infrared technology, which belongs to the technical field of wafer cutting detection. Background technique [0002] When dicing wafers, the cutting machine will detect the knife marks online, but in order to meet the requirements of mass production, the cutting quality of the knife marks will be inspected every 20--30 steps (can be set), so it will cause the blade Air cutting or incomplete cutting occurs due to severe wear during cutting. Contents of the invention [0003] The purpose of the present invention is to overcome the deficiencies in the prior art and provide an on-line detection system for wafer cutting based on infrared technology, which has a compact structure and strong real-time detection, which ensures normal cutting of the wafer and ensures that the cutting knife is not damaged. Improve the stability of cutting, safe ...

Claims

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Application Information

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IPC IPC(8): B28D7/00
Inventor 陆建刚
Owner NAT CENT FOR ADVANCED PACKAGING
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