Ejector pin device, lower electrode assembly, and assembly and disassembly methods of lower electrode assembly

Abstract

The invention discloses an ejector pin device. The ejector pin device comprises an ejector pin and an ejector pin base. The ejector pin is fixed on the ejector pin base. The ejector pin device is characterized in that the ejector pin device further comprises an ejector pin protection device which is detachably connected with the ejector pin base, and the ejector pin protection device is configured to be surrounded around the ejector pin when being connected onto the ejector pin base. The invention also discloses a lower electrode assembly, and assembly and disassembly methods of the lower electrode assembly. According to the invention, the deformation or fracture of the ejector pin due to the collision between an electrostatic chuck and the ejector pin in the assembly and disassembly processes of the lower electrode assembly can be reduced or avoided, so that the assembly and disassembly efficiency can be improved, the damage of the ejector pin and the influence of the damage of the ejector pin on the assembling and debugging of semiconductor machining equipment can be reduced and avoided, the production cost can be reduced, and the production efficiency can be improved.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to a thimble device, a lower electrode assembly and a method for installing and dismounting the same. Background technique [0002] In semiconductor processing equipment, an electrostatic chuck is used during a semiconductor process to adsorb a wafer on the electrostatic chuck by utilizing the electrostatic adsorption force between the electrostatic chuck and the wafer to perform processes such as etching of the wafer. A thimble device is used together with the electrostatic chuck, and the process of seating and unseating the wafer on the electrostatic chuck can be completed by using the thimble device. [0003] see figure 1 , which shows the structure of the currently commonly used electrostatic chuck and thimble device. Wherein, the electrostatic chuck 3 is fixed on the electrostatic chuck base 5, and a positioning hole 6 is arranged at a position close to the edge of the electrostati...

AI Technical Summary

Problems solved by technology

[0009] First, since the adjustment of the position of the thimble device using the thimble calibration tool and the fixing of the thimble device on the lifting device are all done manually, errors are prone to occur, so that the thimble is not in the proper position, so the subsequent electrostatic chuck During the installation process, it is easy to have contact between the thimble and the electrostatic chuck, resulting in deformation or breakage of the thimble

[0010] Second, even if the position of the thimble is determined manually, in the process of installing the electrostatic chuck, due to the close contact between the positioning pin and the positioning hole on the electrostatic chuck, the coefficient of friction is very large, and the electrostatic chuck has a considerable weight, so It is difficult for the staff to install the electrostatic chuck easily, and it is also easy for the thimble to touch the electrostatic chuck during the installation process of the electrostatic chuck, resulting in deformation or breakage of the thimble

[0011] Third, when the position of the thimble is unreasonable and the electrostatic chuck needs to be removed and reinstalled, or in other processes of disassembling the electrostatic chuck, similarly, due to the tight contact between the positioning pin and the positioning holes around the electrostatic chuck, the friction The coefficient is very large, and the electrostatic chuck has a considerable weight. It is difficult for the staff to remove the electrostatic chuck easily. If the force is slightly careless, it will cause the contact between the thimble and the electrostatic chuck, resulting in deformation or breakage of the thimble.

[0012] Therefore, the deformation or breakage of the thimble during the installation process of the electrostatic chuck and the disassembly process due to the above reasons will affect the installation and debugging of the equipment, increase production costs, and cause a reduction in production efficiency

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