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Polishing pad finisher used for wafer chemical-mechanical planarization equipment

A chemical machinery, polishing pad technology, used in metal processing equipment, grinding machine parts, grinding/polishing equipment, etc., can solve problems such as polishing pad aging, avoid corrosion, no cross-contamination, structure and control methods simple effect

Active Publication Date: 2014-01-15
THE 45TH RES INST OF CETC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to better solve the aging problem of polishing pads, the present invention proposes a polishing pad dresser used in wafer chemical mechanical planarization equipment

Method used

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  • Polishing pad finisher used for wafer chemical-mechanical planarization equipment
  • Polishing pad finisher used for wafer chemical-mechanical planarization equipment
  • Polishing pad finisher used for wafer chemical-mechanical planarization equipment

Examples

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Embodiment Construction

[0026] The following examples are further detailed descriptions of the present invention.

[0027] The structure and application method of the present invention will be described below in conjunction with the accompanying drawings. First, the upper end air bag 104 is inflated slowly, and the swing arm 108 is raised to a certain height through the lever mechanism, and under the action of the swing servo motor 201 and the swing reducer 202, the trimming head (ball head universal structure 107) is rotated from the edge of the polishing table to the center of the polishing table At this time, the rotary servo motor 106 and the rotary reducer 105 drive the dressing wheel (diamond wheel) 207 to rotate through the synchronous pulleys (204 and 206) and the synchronous belt (205), after which the upper airbag 104 is slowly deflated, and the lower airbag 104 is slowly inflated , so that the dressing diamond wheel 207 is pressed tightly on the polishing table (polishing pad) under the dr...

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PUM

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Abstract

The invention discloses a polishing pad finisher used for wafer chemical-mechanical planarization equipment. The polishing pad finisher is mainly composed of a rack, a motor, a speed reducer, an air bag, a synchronous belt, belt wheels, a swing arm, a supporting shaft, a supporting bottom plate, a ball universal structure, a detecting sensor and other components. A lever mechanism inflates the air bag to drive the swing arm to rise, fall and exert finishing force on a polishing bench. By the adoption of the belt wheel transmission mode, the motor and the speed reducer are placed away from a polishing area, and meanwhile a stainless steel protective cover is installed outside the whole finisher to prevent internal electronic components from being corroded. The ball universal structure is arranged at the finishing end to solve the contact problem of a finishing wheel and the polishing bench surface. The polishing pad finisher is simple in structure and control mode, free of cross pollution and good in finishing effect and meanwhile remarkably prolongs service life of a polishing pad.

Description

technical field [0001] The invention relates to the technical field of wafer chemical mechanical planarization (CMP) equipment, in particular to a polishing pad dresser used in wafer chemical mechanical planarization equipment. Background technique [0002] With the development of large-scale integrated circuits, the continuous improvement of integration and the continuous reduction of line width, the quality requirements of wafers are getting higher and higher, especially the surface quality requirements of wafer polishing wafers are becoming more and more stringent. In the chemical mechanical planarization process of wafers, polishing pad is another important consumable besides polishing fluid. As far as the application of the polishing pad is concerned, the chemical properties of the polishing pad material generally require the polishing pad to be resistant to acid and alkali, and to be durable and stable. However, during the planarization process, the surface material o...

Claims

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Application Information

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IPC IPC(8): B24B53/017
CPCB24B53/017
Inventor 柳滨高文泉陈威郭强生
Owner THE 45TH RES INST OF CETC
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