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Low temperature co-fired ceramic amplitude limiting filter

A low-temperature co-fired ceramic and filter technology, applied in the microwave field, can solve the problem of high cost and achieve the effect of compact overall structure of the device

Inactive Publication Date: 2013-11-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The microstrip line filter is easy to manufacture and low in cost, but it needs to use a large lateral size of the substrate, and the lumped element is more suitable for use in the radio frequency band. The position of pins and pads should be considered when designing.

Method used

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  • Low temperature co-fired ceramic amplitude limiting filter
  • Low temperature co-fired ceramic amplitude limiting filter
  • Low temperature co-fired ceramic amplitude limiting filter

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Embodiment Construction

[0037] In order to facilitate the understanding of those skilled in the art, the structural principle of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings:

[0038] Such as Figure 1-Figure 15 As shown, a limiting filter based on LTCC technology can design its lumped element equivalent circuit. The limiting filter includes two PIN diodes connected in parallel with the main transmission line: diode1, diode2, and at the same time on the main transmission line One in series has 90O Bandpass filter with phase shift function. Port1 and Port2 are used as signal input and output ports; TL2 and TL6 are microstrip main transmission lines with 50 ohm impedance matching, TL3 and TL5 are microstrip T-type interfaces connecting PIN diodes and bandpass filters on the main transmission line, TL1 , TL4 is the load of the parallel branch stub line of the microstrip line structure; the main transmission line betwe...

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Abstract

The invention discloses a low temperature co-fired ceramic amplitude limiting filter which comprises an LTCC substrate, an outer metal shell device and an outer metal shell, wherein a passive device is arranged inside the LTCC substrate. An active element is arranged on the surface of the LTCC substrate. The active element comprises two PIN diodes. The positive electrodes of the diodes are connected to the two ends of a main transmission line with 90-degree phase shifting in parallel through microstrip lines. The negative electrodes of the diodes are connected with the ground through metal via holes. A band-pass filter is arranged inside the LTCC substrate in an embedded mode. According to the LTCC amplitude limiting filter, layout packaging is carried out through the multi-layer-ceramic substrate based on the LTCC technology, innovative design is carried out on a circuit structural model and the packaging technology, the miniaturized design aim is achieved to the great degree, and meanwhile the LTCC amplitude limiting filter solves the problem that a traditional device does not have the circuit-protection amplitude limiting function, and can be widely used in microwave receiving systems.

Description

[0001] technical field [0002] The invention belongs to the field of microwave technology, and relates to a filter, in particular to a band-pass filter with an S-band limiting function based on LTCC technology. Background technique [0003] In the microwave system, the microwave filter is a two-port network that controls the frequency response, and can filter out harmonics and suppress spurs. The traditional method uses lumped components in the low frequency band and uses microstrip lines in the high frequency band to make filters. The microstrip line filter is easy to manufacture and low in cost, but it needs to use a large lateral size of the substrate, and the lumped element is more suitable for use in the radio frequency band. The location of pins and pads should be considered when designing. The LTCC process combines the characteristics of the two, and uses the strip line three-dimensional distribution method to complete the equivalent lumped component manufacturing i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H7/12
Inventor 李元勋左林陈振威张怀武苏桦滕林黄树峰沈健康建宏李广新
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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