Automatic bonding machine for connection between chip and glass circuit

Abstract

The invention provides an automatic bonding machine for connection between a chip and a glass circuit, and relates to the technical field of automatic bonding machines. An IC feeding portion (2) is arranged on the rear portion of an automatic bonding machine body (1), an IC disc working area (3) is arranged on the right side of the IC feeding portion (2), an IC empty disc recovery area (4) is arranged on the right side of the IC disc working area (3), an ACF portion (5) is arranged on the left side of the front portion of the automatic bonding machine body (1), a pre-pressing portion (6) is arranged on the right side of the ACF portion (5), a currently pressing portion (7) is arranged on the right side of the pre-pressing portion (6), a mechanical arm portion (9) is arranged on the left side face of the automatic bonding machine body (1), and an IC carrying mechanism (10) is arranged on the rear portion of the automatic bonding machine (1). The automatic bonding machine for connection between the chip and the glass circuit is high in efficiency, little in required manpower and high in ACF attaching accuracy due to the fact that a detection mechanism is arranged.

Description

Technical field: [0001] The invention relates to the technical field of automatic bonding machines, in particular to an automatic bonding machine for connecting chips and glass lines. Background technique: [0002] At present, the automatic bonding machine (hereinafter collectively referred to as COG) for connecting chips and glass lines is composed of semi-automatic equipment, ACF attachment equipment, Chip (IC) pre-pressing equipment, Chip (IC) local pressing equipment and other stand-alone machines. Fractional automatic COG consists of a glass loading unit, an ACF attachment unit, a Chip (IC) loading unit, a Chip (IC) pre-pressing unit, a Chip (IC) local pressing unit, and a product unloading unit. For the current semi-automatic equipment, there are disadvantages such as low efficiency, poor yield rate, and many manpower. For the current fully automatic COG equipment, the bonding capacity of a small-sized single IC is 4 seconds / piece, the ACF attachment accuracy is ±0.2m...

AI Technical Summary

Problems solved by technology

For the current semi-automatic equipment, the efficiency is low, the yield rate is poor, and the manpower is too much.

For the current fully automatic COG equipment, the bonding capacity of a small-sized single IC is 4 seconds / piece, the ACF attachment accuracy is ±0.2mm, and the post-press bonding accuracy is ±5um. At the same time, as the product requirements become more and more High, labor costs are getting higher and higher, so higher requirements are put forward for this type of equipment, the production capacity is 3.5 seconds / piece, the ACF attachment accuracy is ±0.1mm, and the bonding accuracy after pressing is ±3um, so that the current Some equipment in the market cannot meet the market demand

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