Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Antenna impedance matching device, semi-conductor chip and antenna impedance matching method

A matching device and antenna impedance technology, which is applied to antennas, impedance networks, antenna components, etc., can solve the problems that antenna tuners cannot meet the requirements of full-band broadband systems, the frequency tuning range is limited, and general devices cannot be used.

Active Publication Date: 2015-07-08
HUAWEI TECH CO LTD
View PDF3 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, such an impedance matching network structure is still fixed, and for different user equipment, it is necessary to redesign and debug the external components of the antenna tuner semiconductor chip according to the characteristics of the antenna, so that the development cycle is prolonged
Moreover, the structure of the fixed impedance matching network makes the frequency tuning range limited
If you want to cover the broadband frequency range, you must replace the fixed capacitor / inductance device outside the semiconductor chip, so such an antenna tuner cannot meet the requirements of the full-band broadband system
[0007] In addition, the adjustable capacitance semiconductor chip and the external capacitance / inductance device can be packaged into one device, thereby reducing the area of ​​the PCB and reducing the cost. However, since the topology of the impedance matching network and the inductance value of the inductance device are fixed, so , such a device can only be used for a specific mobile phone platform or frequency band, and cannot be used as a general-purpose device, and can only cover a narrow-band frequency range, which cannot meet the requirements of a full-band broadband system
[0008] Since the fixed topology network must be debugged and optimized according to the characteristics of the antenna in order to obtain the best performance, and the inductance value of the off-chip inductor or capacitor element is fixed and not adjustable, the frequency range of the above impedance matching network cannot meet the full-band broadband system requirements

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Antenna impedance matching device, semi-conductor chip and antenna impedance matching method
  • Antenna impedance matching device, semi-conductor chip and antenna impedance matching method
  • Antenna impedance matching device, semi-conductor chip and antenna impedance matching method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0049] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0050] It should be understood that the technical solution of the present invention can be applied to various communication systems, such as: GSM (Global System of Mobile communication, global mobile communication) system, CDMA (Code Division Multiple Access, code division multiple access) system, CDMA2000 system, WCDMA (Wideband Code Division Multiple Access, wideband code division multiple access) system, GPRS (General Packet Radio Service, general pa...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides an antenna impedance matching apparatus (100), semiconductor chip (110), and method. The apparatus includes: a semiconductor chip (110), including multiple adjustable capacitors (111) and multiple switches (112); and at least one impedance component (120), located outside the semiconductor chip, where the semiconductor chip is coupled to the at least one impedance component through multiple terminals and coupled to an input terminal and an output terminal of the antenna impedance matching apparatus, the input terminal and the output terminal of the antenna impedance matching apparatus are respectively coupled to a radio frequency circuit (130) and an antenna (140), the multiple switches are configured to, under control of a control signal, switch a connection between the multiple adjustable capacitors and the at least one impedance component, and values of the multiple adjustable capacitors are adjusted by an adjustment signal, so as to tune impedance matching of the antenna. The apparatus is a reconfigurable impedance matching network, that flexibly realizes different circuit topologies, like L, T, Pi,... topologies, depending on the impedance component and position of the switches.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to an antenna impedance matching device, a semiconductor chip and a method. Background technique [0002] The antenna impedance of the user equipment is easily affected by the external environment. For example, common actions such as the user holding the user equipment, or putting the user equipment close to the head, or putting the user equipment in a pocket may cause significant changes in the antenna impedance. For the RF transceiver system, the impedance mismatch at the antenna port will deteriorate the communication performance. For example, the efficiency of the power amplifier will be reduced, resulting in a decrease in transmit power, an increase in power consumption of the whole machine, and deterioration of the noise figure of the receiver, resulting in a decrease in sensitivity. In addition, with the deployment of the LTE system, the frequency range that the user eq...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01Q23/00H01Q1/50
CPCH03H7/383H01Q1/50H03H2007/386H03H7/38H01Q1/242
Inventor 李伟男刘涛梁建
Owner HUAWEI TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products