Temperature control gas phase working medium perfusion method for micron heat pipe

Abstract

The invention discloses a temperature control gas phase working medium perfusion method for a micron heat pipe, which is applied to heat dissipation of high heating flux devices. The method is characterized in that the temperature of the micron heat pipe and the temperature of a working medium container are respectively controlled; the micron heat pipe and the working medium container are respectively vacuumized; then the working medium container is connected with a working medium source, so that working medium steam can get into the working medium container; the micron heat pipe and the working medium container are communicated, so that perfusion of the gas phase working medium can be realized by utilizing the temperature difference between the micron heat pipe and the working medium container; the perfusion amount of the working medium can be controlled as per time, and after a perfusion port of the micron heat pipe is sealed, working medium perfusion for the micron heat pipe is accomplished. The working medium exists in a perfusion system in gas phase, so the perfusion rate, the repeatability and the controllability are good; the temperature of the micron heat pipe and the temperature of the working medium are respectively controlled, so that the perfusion efficiency of the working medium is improved; the method can improve the performance of the micron heat pipe.

Description

technical field [0001] The invention belongs to the field of micro-device packaging, and relates to a method for gas-phase temperature-controlled perfusion of working fluid in a micro-heat pipe in a vacuum environment, which is applied to heat dissipation of high heat flux density devices. Background technique [0002] With the development of social science and technology, electronic equipment is developing towards multi-function, high power and miniaturization; at the same time, high-density tissue technology is also widely used in various devices. According to statistics, 55% of electronic equipment failure is caused by excessive temperature. Since the 1980s, the heat dissipation density of electronic components has increased by 15 times, and the heat flux density of high-power LEDs and high-performance CPUs has reached 100W / cm 2 above. Therefore, how to efficiently and controllably dissipate the heat in such electronic components reliably has become a hot spot in device...

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that it is greatly affected by the environment, and the working fluid will be lost

The third method is to carry out vacuum working fluid filling and degassing at the same time [Li Yong, He Chengbin, Zeng Zhixin, A method and equipment for vacuum filling and degassing of heat pipes: China, 201210177728.2], this method is suitable for larger structural size Heat pipes, impractical for perfusion volumes of tens to hundreds of microliters in micro heat pipes

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