Method and device for measuring thin substrate deformation

Abstract

The invention relates to a method and a device for measuring thin substrate deformation, belonging to the field of the method and the device for measuring object deformation. The measuring method comprises the following steps of submerging a measured thin substrate into liquid of which the density is close to that of the thin substrate; limiting the thin substrate at a horizontal position in the liquid by adopting a fixing pin; placing a transparent flat plate with high planeness and high parallelism at the junction of the air and the liquid, wherein the upper surface of the transparent flat plate is positioned above the surface of the liquid, and the lower surface of the transparent flat plate is positioned below the surface of the liquid; and scanning and measuring the surface displacement of the thin substrate by adopting an optical displacement sensor. In the measuring device, the optical displacement sensor is fixedly arranged on a vertical translation table through a mounting plate, the thin substrate is supported and limited through three conical pins, and the entire thin substrate is fixed in a solution. Due to the adoption of the method and the device, the influences of the additional deformation of gravity in a thin substrate measuring process are lowered effectively, the deformation of the thin substrate which is small in thickness and is large in planar size can be measured accurately, and the measuring result is accurate and reliable.

Description

technical field [0001] The invention belongs to the field of measuring methods and devices for object deformation, and in particular relates to a measuring method and device for deformation of a thin substrate. Background technique [0002] Thin substrates are thin plates in mechanics, and their geometric features are circular, rectangular or other shapes, and their thickness dimensions are much smaller than the plane dimensions, such as large-diameter ultra-thin silicon wafers in integrated circuit manufacturing, that is, the diameter is greater than 200mm and the thickness is less than 0.2mm . Large-diameter ultra-thin single-crystal sapphire substrates in LED manufacturing, that is, the diameter is greater than 100mm and the thickness is less than 0.2mm, the size of single-crystal SiC substrates is greater than 3 inches in diameter, and the thickness is less than 0.3mm, and ultra-thin in the manufacture of flat panel displays, namely Stainless steel substrates and glass ...

AI Technical Summary

Problems solved by technology

[0004] Aiming at the technical problems of thin substrate deformation measurement and the shortcomings of existing measurement technologies, the present invention invents a thin substrate warpage or bending deformation measurement method and device that reduces the influence of gravity additional deformation

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