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Automatic monocrystal silicon bonding machine

An automatic bonding and monocrystalline silicon technology, applied in the direction of mechanical equipment, connecting components, etc., can solve the problems of low production efficiency of silicon wafers, unfavorable large-scale production of silicon wafers, high production costs, etc., and achieve the effect of large-scale production

Inactive Publication Date: 2013-08-28
SIP GOLDWAY TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This makes the production efficiency of silicon wafers relatively low, and the production cost is high, which is not conducive to the large-scale production of silicon wafers.

Method used

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  • Automatic monocrystal silicon bonding machine
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Embodiment Construction

[0014] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0015] See figure 1 As shown, the single crystal silicon automatic bonding machine 100 of the present invention is used to realize the automatic bonding of crystal silicon fixtures, resins, and single crystal silicon. The single crystal silicon automatic bonding machine 100 includes a single crystal silicon feeding system 10, a crystal silicon fixture feeding system 20, a resin feeding system 30, and the single crystal silicon feeding system 10 and a crystal silicon fixture feeding system. An operating system 40 in which the system 20 and the resin feeding system 30 cooperate.

[0016] See figure 1 As shown, the single crystal silicon loading system 10 includes a single crystal silicon loading rack 11 and a first conveying device 12 installed on the...

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Abstract

The invention discloses an automatic monocrystal silicon bonding machine. The automatic monocrystal silicon bonding machine comprises a monocrystal silicon feeding system, a monocrystal silicon fixture feeding system, a resin feeding system and an operating system matching with the monocrystal silicon feeding system, the monocrystal silicon fixture feeding system and the resin feeding system. The monocrystal silicon feeding system comprises a first conveying device, and the monocrystal silicon fixture feeding system comprises a second conveying device. The automatic monocrystal silicon bonding machine is capable of achieving automatic bonding of monocrystal silicon fixtures, resin and monocrystal silicon, so that large-scale production of silicon wafers is achieved.

Description

Technical field [0001] The invention relates to an automatic bonding machine for monocrystalline silicon. Background technique [0002] In the production of silicon wafers, the crystalline silicon jig used to fix the single crystal silicon, the resin and the single crystal silicon need to be glued together in order. At present, in China, the bonding of the crystalline silicon fixture, resin, and monocrystalline silicon is achieved manually. In this way, the production efficiency of silicon wafers is relatively low and the production cost is relatively high, which is not conducive to the realization of large-scale production of silicon wafers. [0003] In view of the above problems, it is necessary to provide an automatic single crystal silicon bonding machine to solve the above problems. Summary of the invention [0004] In view of the shortcomings of the prior art, the technical problem solved by the present invention is to provide a single crystal silicon automatic bonding machi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F16B11/00
Inventor 李佳
Owner SIP GOLDWAY TECH
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