Polishing method based on dielectrophoresis effect and dedicated equipment thereof

Abstract

The invention discloses a polishing method based on the dielectrophoresis effect and dedicated equipment of the polishing method. The polishing method includes a first step of placing a workpiece on a workpiece clamp, sticking a polishing pad to each insulating plate, a second step of enabling polishing agent and abrasive particles to enter a polishing area, a third step of enabling an upper polishing disk and a lower polishing disk to be connected with an alternating current power supply, wherein a frequency modulation voltage modulation controller controls the alternating current power supply, a non-uniform field is generated, and the polishing agent and the abrasive particles are polarized; and a fourth step of moving the polarized polishing agent and the abrasive particles to the polishing pads. The dedicated equipment constructed according to the polishing method comprises a polisher body which is provided with the upper polishing disk, the lower polishing disk and the workpiece clamp, wherein electrodes are additionally arranged on the upper polishing disk and on the lower polishing disk respectively, each insulating plate is arranged on the surface of one electrode, polishing agent injection openings are formed in the upper polishing disk, and the electrodes are respectively connected with the alternating current power supply, and the current of the alternating current power supply is connected with the frequency modulation voltage modulation controller. The polishing method based on the dielectrophoresis effect and the dedicated equipment of the polishing method have the advantages of slowing down the throwout of the polishing agent and the abrasive particles by the centrifugal force, prolonging the staying time of the polishing agent and the abrasive particles, and enabling the flatness of the workpiece to be higher.

Description

technical field [0001] The invention relates to a polishing method based on dielectrophoretic effect and its special equipment. Background technique [0002] With the continuous improvement of product performance, the modern optoelectronic information field and precision machinery field have higher and higher requirements for the processing accuracy and surface quality of materials. Material processing is the only way to transform raw materials into components. The precision of processing determines the performance of components, and the efficiency of processing determines the promotion and application of materials. [0003] Planar polishing technology is widely used in the final processing of optical parts, semiconductor substrates and various high-precision, high-surface-quality planar components. During the polishing process, the relative speed between the polishing disc and the workpiece is generally formed by the rotation of the polishing disc, and the workpiece materi...

AI Technical Summary

Problems solved by technology

[0006] The present invention aims at the fact that in the current plane polishing process, the polishing liquid and the abrasive grains are thrown out from the processing area by the action of centrifugal force, which causes the amount of abrasives entering the actual polishing area to participate in material removal to decrease, the abrasive processing effect cannot be fully exerted, and the polishing liquid is unevenly distributed in the processing area. In order to solve the problem, a polishing method based on dielectrophoretic effect and its proprietary equipment are proposed without wasting polishing liquid and with good polishing effect

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