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One component epoxy resin composition

A technology of epoxy resin and liquid epoxy resin, which is applied in the field of one-component epoxy resin composition, can solve problems such as insufficient mechanical strength, and achieve the effect of high curing properties

Inactive Publication Date: 2013-07-31
HENKEL IP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the case where a liquid phenolic resin is mainly used as a curing agent, the mechanical strength of the resin obtained by curing the composition (i.e., cured resin) may be insufficient compared to the case where the latent curing agent is mainly used

Method used

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  • One component epoxy resin composition
  • One component epoxy resin composition
  • One component epoxy resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Prepare bisphenol A type epoxy resin ("RE-310S" produced by Nippon Kayaku Co., Ltd., liquid at 25°C (viscosity 13000-17000mPa s), epoxy equivalent 175-190g / eq), containing latent Composition of curing agent ("Novacure HX-3722" produced by Asahi Kasei Co.), allylated novolak resin ("MEH8000H" produced by Meiwa Plastic Industry Co., Ltd., liquid at 25°C (viscosity 2000±1000mPa·s ), hydroxyl equivalent weight 141±2g / eq), silane coupling agent (γ-glycidoxypropyl trimethoxysilane) and organic acid (barbituric acid), according to the mixing ratio shown in Table 1 These materials are mixed to prepare a one-part epoxy resin composition.

[0077] "Novacure HX-3722" manufactured by Asahi Kasei Co., Ltd. is a composition containing a latent curing agent. The content of latent curing agent in "Novacure HX-3722" is 30-40% by weight.

[0078] Next, the properties of the obtained curable resin composition were measured as follows. The measurement results are shown in Table 1.

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Embodiment 2

[0090] A curable resin composition was prepared in the same manner as in Example 1 except that the amount of each material used was changed to the value shown in Table 1, and its properties were measured. The measurement results are shown in Table 1.

Embodiment 3

[0092] A curable resin composition was prepared in the same manner as in Example 1, and its properties were measured, except that 0.4 parts of triethyl borate was used instead of barbituric acid and the amount of each material used was changed to the value shown in Table 1. The measurement results are shown in Table 1.

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PUM

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Abstract

Problem to be solved of the invention is to provide a one component epoxy resin composition having a high curing property, wherein a cured resin thereof exhibits a physical strength equal to that in the case where a latent curing agent is predominantly used. Means for solving the problem is a one component epoxy resin composition comprising (a) 100 parts by weight of liquid epoxy resin; (b) suitable amounts for curing the liquid epoxy resin of a latent curing agent; and (c) not more than 30 parts by weight of liquid phenol resin.

Description

technical field [0001] The invention relates to a one-component epoxy resin composition, in particular to a one-component epoxy resin composition using a latent curing agent. Background technique [0002] Due to the excellent properties of cured products of epoxy resins in terms of mechanical properties, electrical properties, thermal properties, chemical resistance and adhesive properties, epoxy resins have been used in a wide range of applications such as coating materials, electrical and electronic insulation materials and adhesives. Especially in recent years, in order to improve productivity in electronic material applications, one-component epoxy resin compositions having excellent curing properties and storage stability are required. [0003] Many one-component epoxy resin compositions have been proposed so far. As an example of a one-component epoxy resin composition, there is a one-component epoxy resin composition in which a latent curing agent such as dicyandiam...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/50C08G59/56C08G59/62
CPCC08G59/50C08G59/182C08G59/56C08G59/62C08G59/621C08L63/00
Inventor 陈纯福
Owner HENKEL IP
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