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Single-point ring-shaped measuring method for thickness of surface mounting technology (SMT) screen

A measurement method and stencil technology, applied in the direction of measuring devices, instruments, optical devices, etc., can solve the problem of large error of SMT stencil, achieve the effect of reducing error, improving measurement accuracy, and small error

Inactive Publication Date: 2013-07-24
KUNSHAN THETA MICRO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is the problem that the error is relatively large in the thickness measurement of the SMT stencil in the laser micromachining industry in the prior art

Method used

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  • Single-point ring-shaped measuring method for thickness of surface mounting technology (SMT) screen
  • Single-point ring-shaped measuring method for thickness of surface mounting technology (SMT) screen
  • Single-point ring-shaped measuring method for thickness of surface mounting technology (SMT) screen

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] A kind of SMT stencil single-point thickness annular measurement method, comprises following several steps:

[0023] a) Set the variable r representing the radius difference between adjacent rings before measurement, and the number n of collected rings;

[0024] b) If the coordinates of the measurement point M on the screen are M(x, y), first move the laser displacement sensor to the position of the measurement point M through the axis movement, and then move the r distance in the positive direction of the x-axis, that is, the measurement point is M(x+r,y);

[0025] c) The sensor moves along a circle with the measurement point M as the center and r as the radius, and collects sensor readings to obtain thickness data. After completing the scanning of the entire circle, stop data collection, and take the average value of the thickness data collected on the circle as The thickness of the circle; among them, the coaxial double vertical laser displacement sensor is used to ...

Embodiment 2

[0033] A kind of SMT stencil single-point thickness annular measurement method, comprises following several steps:

[0034] a) Before the measurement, the variable r representing the radius difference between adjacent rings is set, and the number of collected rings is 10;

[0035] b) If the coordinates of the measurement point M on the screen are M(0,0), first move the laser displacement sensor to the position of the measurement point M through the axis movement, and then move the r distance in the positive direction of the x-axis, that is, the measurement point is M(r,0);

[0036] c) The sensor moves along a circle with the measurement point M as the center and r as the radius, and collects sensor readings to obtain thickness data. After completing the scanning of the entire circle, stop data collection, and take the average value of the thickness data collected on the circle as The thickness of the circle; among them, the coaxial double vertical laser displacement sensor is...

Embodiment 3

[0043] This method will collect the thickness of a certain number of rings with the measuring point as the center within the range near the measuring point, and take their weighted average to represent the thickness of the point.

[0044] 1. Before the measurement, set the variable r representing the radius difference between adjacent rings, and the number of collected rings is 5.

[0045] 2. If the coordinates of the measurement point on the screen are (1,0), first move the laser displacement sensor to the position of the measurement point through the axis movement, and then move the r distance in the positive direction of the x-axis, that is (1+r,y ).

[0046] 3. The sensor starts to move along the circle with the measurement point as the center and r as the radius, and collects the sensor readings to obtain thickness data. After completing the scanning of the entire circle, stop data collection, and take the average value of the thickness data collected on the circle as Th...

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Abstract

The invention relates to a single-point ring-shaped measuring method for thickness of a surface mounting technology (SMT) screen. The problem that an error is large when the thickness of an SMT screen is measured in an existing laser micromachining industry is solved. The single-point ring-shaped measuring method for the thickness of the SMT screen comprises the steps of setting variable quantity r which represents radius differences of adjacent round rings and setting the number of collected round rings before measurement; if the coordinate of a measuring point M on screen breadth is M (x, y), firstly moving a laser displacement sensor to the position of the measuring point M through axis movement and then moving the laser displacement sensor with a distance r to the positive direction of an x axis, wherein the measuring point is M (x+r, y); collecting reading numbers of the sensor to obtain thickness data; moving the laser displacement sensor with a distance r along the positive direction of the x axis and obtaining the thickness of a circle according to the method; and repeating the steps until the thicknesses of n round rings are obtained. The problem is solved, and the single-point ring-shaped measuring method for the thickness of the SMT screen can be used in the laser micromachining industry.

Description

[0001] technical field [0002] The invention relates to a single-point thickness circular measurement method for SMT screen plates, in particular to a thickness measurement method using a laser displacement sensor in the laser microprocessing industry. Background technique [0003] In the laser micromachining industry, for SMT (Surface Mount Technology) stencils, it is necessary to measure the thickness of the stencil to check whether the stencil meets the requirements. Generally, a certain number of points are taken at average intervals in the stencil format to measure these The thickness of the point to represent the average thickness of the stencil, such as figure 1 . The conventional measurement method only takes one point when measuring the thickness of the point, and does not take into account the flatness of the stencil in the vicinity, so it cannot represent the thickness of the position near the point, such as figure 2 As shown, the part of the stencil is uneven...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01B11/06
Inventor 魏志凌宁军沈晓
Owner KUNSHAN THETA MICRO
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