Flip-chip welding spot defect detection method through temperature observation and measurement

Abstract

The invention provides a flip-chip welding spot defect detection method through temperature observation and measurement, and relates to a flip-chip welding spot defect detection method. The method includes the steps of: arranging a thermal imaging system at one side of a flip chip, arranging an infrared laser at one side of a substrate, aligning an infrared laser beam to a to-be-detected welding disc of the substrate of the flip chip, adjusting power and pulse width parameters and performing thermal excitation on the power and pulse width, wherein the thermal imaging system detects the temperature rising process of a chip ball-welding zone connected with the welding disc in real time, observes and shoots a thermal image of a highest temperature rising point, and judges a flip-chip welding spot defect according to the temperature rising curve or the thermal image. The flip-chip welding spot defect detection method for empty welding adopts point-by-point detection and has the characteristics of no damage, high defect recognition rate and simplicity and intuition in judgment; and besides, the method has a wide application range, can be suitable for the detect detection in chip side ball placement and the detect detection in substrate side ball placement during three-dimensional assembly.

Description

technical field [0001] The invention relates to a detection method for chip solder joint defects, in particular to a detection method for flip-chip solder joint defects. Background technique [0002] With the development of electronic packaging technology in the direction of high density, high performance and miniaturization, BGA (Ball Grid Array) packaging has become the mainstream of contemporary electronic packaging. Ceramic ball grid array CBGA (CeramicBall Grid Array), as a packaging form of BGA, is widely used in military, aviation and aerospace electronic equipment manufacturing fields due to its high I / O density, high reliability and good electrical and thermal performance . CCGA (Ceramic Column Grid Array) is an improvement based on CBGA. It replaces the ball array with a column array, which relieves the shear stress between the ceramic substrate and the PCB caused by thermal mismatch, and improves thermal cycle reliability. [0003] The miniaturization of microel...

AI Technical Summary

Problems solved by technology

[0009] Aiming at the defect that the existing detection technology cannot meet the actual demand of production, the present invention provides a reliable detection method for visual temperature measurement of solder joint defects of flip-chip

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