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Frame structure

A technology of rack structure and cable management structure, applied in the direction of rack/frame structure, cooling/ventilation/heating transformation, etc., can solve problems such as high temperature and crash, and achieve the effect of saving stack arrangement space

Inactive Publication Date: 2013-07-03
INVENTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the more heat energy a computing device generates, the higher its temperature may be
If the temperature of the computing device is higher, the probability of crash will be higher

Method used

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Embodiment Construction

[0034] The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any ordinary person in the art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of claims and the accompanying drawings , any person of ordinary skill in the art can easily understand the related objects and advantages of the present invention. The following examples are to further describe the viewpoints of the present invention in detail, but not to limit the scope of the present invention in any way.

[0035] Please refer to figure 1 , is a perspective view of the frame structure 10 of the embodiment of the present invention. The rack structure 10 of the present invention includes a frame 110 and a computing device receiving rack 120 . Please refer to figure 2 ,yes figure 1 A cutaway perspective ...

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Abstract

The invention relates to a frame structure. The frame structure comprises a framework, an arithmetic device accommodating rack, at least one fan and a wire arrangement structure. The framework is provided with a first side edge, a second side edge opposite to the first side edge and a third side edge between the first side edge and the second side edge. The arithmetic device accommodating rack is arranged in the framework, and is adjacent to the first side edge and the third side edge. The arithmetic device accommodating rack is provided with a plurality of accommodating layers, and each accommodating layer is used for accommodating an arithmetic device. The fan is arranged in the framework, and is adjacent to the second side edge and the third side edge. The fan is provided with an air inlet facing to the arithmetic device accommodating rack. The wire arrangement structure is arranged in the framework, and is adjacent to the third side edge. The wire arrangement structure is accommodated between the fan and the arithmetic device accommodating rack, so that a heat dissipation space is formed between the fan and the arithmetic device accommodating rack.

Description

technical field [0001] The invention relates to a frame structure, in particular to a frame structure with cooling fans. Background technique [0002] In today's era where people have more than one computer, and each computer needs to use the network, the computing requirements of computing devices serving many computers are also increasing, and each computing device in use will generate The heat energy is also increasing. However, the more heat energy generated by a computing device, the higher its temperature may be. If the temperature of the computing device is higher, the probability of crash will be higher. Generally speaking, when installing computing devices, there must be enough space to easily dissipate energy. However, the land space occupied by each population in today's society is getting smaller and smaller. Therefore, in a limited space, it is a problem that must be overcome at present to dissipate the heat energy generated by the computing device to reduce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/18H05K7/20
Inventor 颜宏文
Owner INVENTEC CORP
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