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Phase change resistor in phase change memory and forming method thereof

A technology of phase change memory and phase change resistor, applied in electrical components and other directions, can solve the problems of corrosion, the increase of trench aspect ratio, affecting the filling of phase change materials, etc., to achieve small corrosion, increase isolation, and avoid mutual influence Effect

Active Publication Date: 2013-07-03
SEMICON MFG INT (SHANGHAI) CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The problem that the present invention solves is the method for forming phase-change resistance in the prior art, and the storage state of adjacent stor

Method used

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  • Phase change resistor in phase change memory and forming method thereof
  • Phase change resistor in phase change memory and forming method thereof
  • Phase change resistor in phase change memory and forming method thereof

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Embodiment Construction

[0091] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0092] In the following description, specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described here, and those skilled in the art can make similar extensions without departing from the connotation of the present invention. Accordingly, the present invention is not limited to the specific embodiments disclosed below.

[0093] image 3 It is a flowchart of a method for forming a phase change resistance in a phase change memory according to the first embodiment of the present invention, refer to image 3 , The method for forming the phase change resistor in the phase change memory according to the first e...

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Abstract

The invention provides a phase change resistor in a phase change memory and a forming method thereof. The forming method of the phase change resistor in the phase change memory includes the steps that a substrate is provided, a bottom electrode is formed in the substrate, the upper surface of the bottom electrode is even with the upper surface of the substrate, a first medium layer and a second medium layer are sequentially formed on the substrate, a through hole is formed in the first medium layer, a groove is formed in the second medium layer, a part of the bottom electrode is exposed from the bottom of the through hole, the through hole is exposed from the groove, the width of the groove is larger than the bore diameter of the through hole, the groove extends along the bit line direction of the phase change memory, phase change materials are filled in the through hole and the groove so that the phase change resistor can be formed, and the upper surface of the phase change resistor is even with the upper surface of the second medium layer. According to the technical scheme, as adjacent memory units are isolated through medium layers, mutual interference between the adjacent memory units can be avoided, and the phase change materials are easy to fill. In addition, the problem of stripping of the phase change materials can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a phase-change resistor in a phase-change memory and a forming method thereof. Background technique [0002] With the development of information technology, the demand for storage devices is increasing, which promotes the development of storage devices in the direction of high performance, low voltage, low power consumption, high speed and high density. Phase change memory (PCRAM, phase change Random Access Memory) is a new generation of non-volatile memory developed on the basis of CMOS integrated circuits, which uses one or more elements of Group V or Group VI in the periodic table of elements The alloy is used as a phase-change resistor, and the phase-change resistor is used as a storage unit. The phase-change resistor can quickly change from an ordered crystalline state (low resistance) to a disordered amorphous state ( resistance is much higher). A typical phase cha...

Claims

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Application Information

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IPC IPC(8): H01L45/00
Inventor 朱南飞吴关平
Owner SEMICON MFG INT (SHANGHAI) CORP
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