Package structure of Schottky diode

Abstract

The invention relates to a package structure of a Schottky diode, comprising a chip, a jumper wire and a metal frame, wherein the metal frame comprises a base metal frame and two lead-out metal frames which are arranged opposite to each other at intervals; the lower surface of the chip is welded with the upper surface of the base metal frame; the upper surface of the chip is welded with one end of the jumper wire; the other end of the jumper wire is welded on the upper surfaces of the lead-out metal frames; plastic packaging bodies are wrapped between the base metal frame and the lead-out metal frames, above the base metal frame and the lead-out metal frames and above and at the periphery of the chip and the jumper wire; the lower surfaces of the base metal frame and the lead-out metal frames are exposed outside the plastic package bodies; and pins extend from the base metal frame and the lead-out metal frames and positioned outside the plastic package bodies. The package structure of the Schottky diode has the beneficial effects that the heat-dissipating efficiency is high; the reliability is improved; the service life is prolonged; and the quality is improved.

Description

technical field [0001] The invention relates to a packaging structure of a Schottky diode. Background technique [0002] At present, the packaging of the Schottky diode is an important step related to the performance of the Schottky diode, but the current packaging structure is simple and unreasonable, especially the heat dissipation performance is poor, which also affects the service life of the Schottky diode. Moreover, when the chip is soldered at high temperature, the chip is prone to rotation, which increases the difficulty of soldering. The positioning accuracy of the jumper above the chip is not high, which affects the production efficiency and quality of the product. Contents of the invention [0003] In order to solve the above technical deficiencies, the present invention provides a Schottky diode packaging structure with good heat dissipation and high quality. [0004] The present invention is achieved through the following measures: [0005] A Schottky diod...

AI Technical Summary

Problems solved by technology

[0002] At present, the packaging of Schottky diodes is an important step related to the performance of Schottky diodes, but the current packaging structure is simple and unreasonable, especially the heat dissipation performance is poor, which also affects the service life of Schottky diodes

Moreover, when the chip is soldered at high temperature, the chip is prone to rotation, which increases the difficulty of soldering

The positioning accuracy of the jumper above the chip is not high, which affects the production efficiency and quality of the product

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