Diode packaging device

Abstract

The invention discloses a diode packaging device, which comprises a base, at least one conveying mechanism, a driving mechanism, a spot gluing mechanism and at least one mechanical hand mechanism, wherein the at least one conveying mechanism is slidably connected with the base; the driving mechanism is arranged on the base and used for driving the conveying mechanism to a plurality of stations; the spot gluing device is arranged on the base and above the moving direction of the conveying mechanism, and the spot gluing mechanism comprises at least one spot gluing head; the at least one mechanical hand mechanism is slidably and / or rotatably connected with the base; and the spot gluing mechanism and the at least one mechanical hand mechanism are provided with the stations along the moving direction of the conveying mechanism in sequence. According to the diode packaging device, the processing efficiency can be improved, and the consistency of diode finished products is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a diode packaging device. Background technique [0002] In the packaging process of the diode, it is a very important process to attach the chip between the upper and lower material sheets of the diode. [0003] Traditionally, the realization of this process is mostly realized by manual or semi-manual methods. The specific implementation method is: the first worker uses a glue dispenser to dispense glue on the lower material, and then moves the lower material that has been dispensed to the next worker. Sieve the crystal grains (that is, chips) to the dispensing position of the lower material through the shaking plate to complete the crystal bonding, and then move the semi-finished product after the crystal bonding to the next worker, who then uses the glue dispenser on the upper material. Do glue dispensing, and then attach the upper material sheet to the finish...

AI Technical Summary

Problems solved by technology

[0005] The disadvantage of the above-mentioned prior art is that the traditional manual work method requires at least 3-4 people to work, even if a crystal bonder is used to assist the work, at least 2-3 people are needed to do the work, because The die bonding machine only realizes the two steps of dispensing and solidifying the blank, but the step of attaching the blank to the blank and the chip still needs to be done manually, so It still consumes a lot of human resources

On the one hand, in today's increasingly bullish labor costs and labor shortages, many companies are trying their best to reduce the number of workers to control the cost of the company or ensure the normal production of the company. The above-mentioned operation methods are obviously difficult to meet the needs of the company, and The production efficiency of manual or semi-manual operation is obviously not high, and the emotional level of workers will inevitably affect their work, making the processing efficiency unstable; on the other hand, this manual or semi-manual operation It will also bring about the consistency of product prices, such as uneven glue dispensing, insufficient bonding strength, etc. This inconsistency will also directly affect the quality of the finished product

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