Gas mixing and distributing structure of double-chamber or multi-chamber thin film deposition equipment

Abstract

The invention belongs to the field of semiconductor thin film deposition equipment and in particular relates to a gas mixing and distributing structure of double-chamber or multi-chamber thin film deposition equipment. The gas mixing and distributing structure comprises a gas mixing chamber, gas inlet pipelines, at least two gas outlet pipelines and a gas intake baffle, wherein the bottom surface of the gas mixing chamber is connected with the first gas inlet pipeline and the second gas inlet pipeline, the gas intake baffle which is arranged on the bottom surface of the gas mixing chamber is arranged above the first gas inlet pipeline and the second gas inlet pipeline, and the inlet of the first gas inlet pipeline and the inlet of the second gas inlet pipeline are respectively positioned below the gas intake baffle; and at least two gas outlet pipelines are symmetrically connected to two opposite side surfaces of the gas mixing chamber. According to the gas mixing and distributing structure, various process gases can be sufficiently mixed, gases among chambers are uniformly distributed, and therefore a same process state can be kept among the chambers; and in addition, the gas mixing and distributing structure is simple in structure, low in cost, small in size and convenient to install and maintain.

Description

technical field [0001] The invention belongs to the field of semiconductor thin film deposition equipment, in particular to a gas mixing and distribution structure of double chamber or multi-chamber thin film deposition equipment. Background technique [0002] The principle of thin film deposition technology is to place the wafer in a vacuum environment, inject an appropriate amount of reactive gas, and use the physical changes and chemical reactions of the gas to form a solid film on the surface of the wafer. [0003] U.S. patents related to mixed gas intake, such as the U.S. patent with the publication date of July 15, 2003 and the publication number 6591850, and the publication date of the U.S. patent with the publication number of 6758591 on July 6, 2004, the publication date is U.S. Patent Publication No. 7204155 on April 17, 2007, U.S. Patent Publication No. 2003176074 on Sept. 18, 2003, U.S. Patent Publication No. 2008202610 on Aug. 28, 2008 , the publication date is...

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Problems solved by technology

[0003] U.S. patents related to mixed gas intake, such as the U.S. patent with a publication date of July 15, 2003 and a publication number of 6,591,850, and the publication date of a U.S. patent with a publication number of 6,758,591 on July 6, 2004, and a publication date of U.S. Patent Publication No. 7204155 on April 17, 2007, U.S. Patent Publication No. 2003176074 on Sept. 18, 2003, U.S. Patent Publication No. 2008202610 on Aug. 28, 2008 , the publication date is December 16, 2003, the publication number is the U.S. patent of 6662817, etc., the above-mentioned U.S. patent applications use flow meters, flow meter controllers, valves, sensors and other equipment to control gas flow and pressure, and the cost is high. The structure is complex and takes up a lot of space

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