Wire Saw Control System And Wire Saw

A control system, wire saw technology, applied in the field of worn or damaged wire saw control systems, defects, operating wire saws, multi-wire saws, and can solve problems such as non-use of wire, financial loss, unsatisfactory sawing results, etc.

Active Publication Date: 2013-05-08
TOYO ADVANCED TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the wire is wound up on a spool for used wire when the wire is still efficient and safe enough to saw other objects such as wafers, the wire is not used optimally, causing financial loss
On the other ha...

Method used

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  • Wire Saw Control System And Wire Saw
  • Wire Saw Control System And Wire Saw
  • Wire Saw Control System And Wire Saw

Examples

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Embodiment Construction

[0022] Reference will now be made in detail to various embodiments of the invention, one or more examples of which are illustrated in the accompanying drawings. In the following description of the drawings, the same reference numerals refer to the same components. Generally, only the differences of the various embodiments are described. Each example is provided by way of explanation of the invention, not limitation of the invention. Additionally, features illustrated or described as part of one embodiment can be used with other embodiments to yield yet a further embodiment. The present description is intended to cover such modifications and variations.

[0023] Furthermore, in the following description, a "wire saw control system" or simply "control system" may be understood as a system that controls some or all of the functions of the wire saw. Generally, a wire saw understood in this specification may be a segmenter, a squarer or a wafer cutting wire saw. Typically, the ...

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PUM

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Abstract

The invention discloses a wire saw control system and a wire saw. The wire saw control system (1) for operating a wire saw (100) is provided. The wire saw is adapted for cutting a wafer (304, 304, 306, 308) by moving the wire (230) relatively to the wafer with a selectable wire speed. The wire saw control system includes a camera (20) for inspecting the wire, and a camera control unit (25) for operating the camera in dependence of the wire speed. Furthermore, a wire saw including the wire saw control system is provided, and a method for inspecting a wire of a wire saw. The method includes moving the wire with a variable wire speed; and inspecting the wire in dependence of the wire speed, thereby obtaining an inspection result.

Description

technical field [0001] The invention relates in particular to a wire saw control system for checking the wire of a wire saw, a wire saw, a method for checking the wire of a wire saw and a method for operating a wire saw. Existing wire saws can be retrofitted with the wire saw control system according to the invention. More specifically, the present invention relates to a wire saw control system for detecting defects, wear or damage to a wire of a wire saw. The invention relates in particular to multi-wire saws. The wire saw of the invention is particularly suitable for cutting or sawing hard materials such as blocks of silicon or quartz, for example for cutting silicon wafers, for squarers, for sectioning machines and the like. Background technique [0002] Wire saws are used for cutting blocks or bricks, thin slices, eg semiconductor wafers, from a sheet of hard material such as silicon. In this device, wire is fed from a spool and is guided and tensioned by a wire guide...

Claims

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Application Information

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IPC IPC(8): B28D7/00B28D5/04
CPCB28D5/045B28D5/0064
Inventor 菲利普·那斯卡吉恩-马克·罗斯特
Owner TOYO ADVANCED TECH CO LTD
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