Airflow balancing plate, chamber device and substrate processing device

Abstract

The invention discloses an airflow balancing assembly, a chamber device and a substrate processing device. The airflow balancing assembly comprises a first annular plate and a second annular plate, wherein the first annular plate is provided with a first opening; a plurality of through holes are formed in the first annular plate; the second annular plate is provided with a second opening and is arranged on the first annular plate in an adjustable manner for partially shielding the plurality of the through holes in the first annular plate; the radial width of the second annular plate is changed along the circumferential direction of the second annular plate, so that the areas of the plurality of the through holes shielded by the second annular plate are changed along the circumferential direction of the first annular plate. The air balancing assembly provided by the embodiment of the invention is beneficial to improving the air distribution uniformity, and can improve the processing uniformity of the substrate. Besides, the airflow balancing assembly with the structure has a simple structure, is easy to manufacture, and low in cost. Besides, the adjustment can be flexibly implemented for different chamber structures, processes or chamber pressures.

Description

technical field [0001] The invention relates to the field of semiconductor substrate processing, more specifically, to an airflow equalization plate, a chamber device and substrate processing equipment. Background technique [0002] In the manufacture of semiconductor devices, several identical devices will be designed on the silicon wafer. As the size of the device decreases, it becomes more important to ensure the performance of each device is consistent, which will directly determine the improvement of product yield. It is beneficial to increase output and reduce manufacturing cost. Etching uniformity is a parameter to measure the etching effect of the etching process on the entire silicon wafer, or between silicon wafers, or even between batches, and it is also a parameter to measure the process performance of etching equipment. One of the important parameters. [0003] In plasma etching technology, an important factor affecting etching uniformity is gas flow. Since t...

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Problems solved by technology

[0006] However, the manufacturing difficulty of the airflow equalization plate with this structure increases, and the price also increases

In addition, since the distribution of multiple through holes is fixed, it is not possible to adjust the gas flow multiple times under different processes or chamber pressures

However, if multiple airflow equalization plates are designed, it will not only increase the equipment cost, but also make the equipment maintenance more cumbersome, and the stability of the chamber will be affected to a certain extent.

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