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Post production process of thin panels

A post-production and process technology, applied in the field of post-production of thin plates, can solve problems such as breakage, easy loosening, and appearance damage, and achieve the effect of improving the quality of thin plates, ensuring accuracy, and increasing flexibility.

Active Publication Date: 2015-07-08
南通胜宏科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These three processes are all PANEL boards (that is, unformed sheets) first formed into SET boards, and then testing, FQC (referring to the final inspection and verification of SET boards), surface treatment and other processes, because The body of the circuit board is relatively brittle. If the circuit board is molded without surface treatment, it is easy to loosen, which will cause some SET boards to be damaged and scrapped.
In addition, during the process of testing, final inspection and verification, surface treatment, etc., the boards with hidden quality problems in the molding process are prone to damage, breakage and scrapping during transportation.
The above problems are more prominent in the thin plate, so the thin plate produced by the above three technological processes not only has a high scrap rate, but also has a higher possibility of quality problems

Method used

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Experimental program
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Effect test

Embodiment 1

[0031] In this embodiment, the single-sided thin board is post-fabricated by using the post-fabrication process of the thin board disclosed in the present invention.

[0032] The process flow is as follows:

[0033] According to the conventional practice, the processes of material cutting, drilling, wiring, solder mask, text printing, etc. are carried out, and the PANEL board is preformed before the chemical gold process. The shape of the SET board, retaining the connecting parts between the SET boards; the reserved connecting parts between the SET boards include two connecting bridges arranged on the two non-adjacent peripheries of the SET boards, and the connecting bridges are arranged in the middle of the peripheries, And the width of the connecting bridge is 1 cm. After the PANEL board is preformed, the blue adhesive layer is pasted on the entire board of the two boards of the PANEL board.

[0034] Then the preformed PANEL board is subjected to chemical gold, whole board...

Embodiment 2

[0038] In this embodiment, the double-sided sheet is post-fabricated by using the sheet post-production process disclosed in the present invention.

[0039] The process flow is as follows:

[0040] According to the conventional practice, the processes of material cutting, drilling, wiring, solder mask, text printing, etc. are carried out, and the PANEL board is preformed before the chemical gold process. The shape of the SET board, the connection parts are reserved between the SET boards; the connection parts reserved between the SET boards include four connection bridges arranged on the four sides of the SET board, the connection bridge is set in the middle of the periphery, and the width of the connection bridge is 0.5 cm. After the PANEL board is preformed, the blue adhesive layer is pasted on the entire board of the two boards of the PANEL board.

[0041] Then the preformed PANEL board is subjected to chemical gold, whole board test, final inspection and verification of ...

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Abstract

The invention discloses a post production process of thin panels. The post production process includes subjecting a PANEL to preforming before a gold immersion procedure, subjecting the preformed PANEL to gold immersion, integral panel testing and final check and verification, and integral panel surface treatment procedure sequentially, subjecting the PANEL subjected to the integral panel surface treatment to second SET panel forming and screwing, subjecting SET panels to secondary check and verification, package and delivery. The preforming treatment step includes screwing shape of each SET panel on the PANEL before gold immersion, connection parts are reserved among the SET panels, and blue adhesive layers are attached on two plate surfaces of the integral PANEL after the PANEL is subjected to preforming. By producing the thin plates by the post production process, quality of PCBs (printed circuit boards) of the thin panels can be effectively improved, and rejection rate is decreased.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a thin board post-production process for small, light and thin circuit boards. Background technique [0002] With the development of technology, electronic products such as mobile phones, notebook computers, PADs, and digital cameras are becoming thinner and thinner. Tiny external chips have become an essential device for various electronic products, but designing and manufacturing thin and light circuit boards that match the tiny chips is a technical problem in the circuit board manufacturing industry. According to the number of layers of the circuit board, the PCB board production mainly adopts the following three processes: [0003] 1. Single-sided panel process: cutting, drilling, wiring, solder mask, text printing, chemical gold, molding, testing, final inspection and verification, surface treatment, packaging and shipment. [0004] 2. Double-sided panel p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 张显栋王振
Owner 南通胜宏科技有限公司
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