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Socket for LED lamp filament

An LED filament and socket-connecting technology, applied in lighting and heating equipment, electrical components, circuits, etc., can solve the problems of unsightly exposed solder joints, inefficient welding methods, and easy contamination of surface silicone phosphors. The effect of electrical access

Inactive Publication Date: 2013-03-20
SHANGHAI DANGOO ELECTRONICS TARDING
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0005] Generally, LED filaments use soldering wires as electrical connections. Due to the small solder pads that are not easy to solder, the filaments are thin, and the surface is easily polluted by silica gel phosphors, the efficiency of the soldering method is not high, and the exposed solder points are not beautiful. A convenient and efficient electrical connection and socket

Method used

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  • Socket for LED lamp filament
  • Socket for LED lamp filament

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Embodiment Construction

[0014] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0015] Such as figure 1 , Shown in 2, the LED filament socket of the present invention includes socket body 2, electrode shrapnel and the like. At least one chute 5 is provided in the socket body 2, and at least one electrode shrapnel is contained in the chute 5.

[0016] Such as figure 2 As shown, the chute 5 contains two electrode shrapnel, one is the positive shrapnel 4, which is connected to the positive electricity, and the other is the negative shrapnel 3, which is connected to the negative electricity, and is located on both sides of the chute 5, and the electrode shrapnel is covered with plastic. It is used to fix the position of the electrode shrapnel. There are several irregular small bumps 6 on the contact surface of the electrode shrapnel, which are used to contact and clamp the positive and negative poles of the LED filament.

[0017] C...

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Abstract

The invention relates to a socket for an LED (light-emitting diode) lamp filament, which comprises a socket body and elastic electrode plates, wherein at least one tilted trough is formed in the socket body and internally provided with at least one elastic electrode plate. The tilted trough is internally provided with the two elastic electrode plates, namely an elastic positive electrode plate connected with positive electricity and an elastic negative electrode plate connected with negative electricity; the elastic positive electrode plate and the elastic negative electrode plate are positioned on the two sides of the tilted trough; the elastic electrode plates are wrapped with plastic which is used for fixing the elastic electrode plates; a plurality of irregular small bumps are formed on contact surfaces of the elastic electrode plates, contacted with a positive electrode and a negative electrode of the LED lamp filament and used for clamping the positive electrode and the negative electrode of the LED lamp filament; the tilted trough is square, rectangular or polygonal; and the elastic positive electrode plate and the elastic negative electrode plate are arranged in the socket body in an injection molding manner. The socket has the advantages that the lamp filament can be connected electrically quickly and accurately; a position of the lamp filament can be fixed; and an angle of the lamp filament can be controlled.

Description

technical field [0001] The invention relates to a socket for connecting LED filaments, in particular to a socket for LED filaments packaged into strip-shaped LED filaments. Background technique [0002] LED is a light-emitting diode (LED, Lighting emitted diode), which is a solid-state light-emitting device that uses the PN junction to emit light under the action of an electric field. With the characteristics of high life / environmental protection / energy saving, it is a new green light source. [0003] LED technology is becoming more and more mature. At present, LED white light is white light produced by exciting yellow-green phosphors through blue chips and reconciling wavelengths. At present, the luminous efficiency of LEDs has exceeded most traditional light sources. Generally speaking, LED grows a PN layer and a light-emitting layer on an epitaxial wafer through MOCVD (Metal-organic Chemical Vapor Deposition), and then makes it into different sizes by spot measurement, d...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62
CPCH01L33/62F21V21/00F21V19/0025F21Y2115/10
Inventor 娄永发张林夫瞿崧
Owner SHANGHAI DANGOO ELECTRONICS TARDING
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