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Three-dimensional interface stress sensor

A stress sensor and three-dimensional interface technology, applied in the direction of instruments, measuring force, measuring devices, etc., can solve the problems of large geometric size, difficulty in integrating sensor arrays, complex peripheral circuits, etc., to reduce geometric size, simplify peripheral circuits, increase Effect of large measuring range

Active Publication Date: 2014-09-17
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] To sum up, the reported interface stress sensors have the following disadvantages: (1) they can only measure normal stress, but cannot measure shear force at the same time, that is, they cannot solve the problem of real-time measurement of three-dimensional interface stress; (2) the geometric size is too large , can not be used in the narrow space of prosthetics or shoe soles; (3) low sensitivity, too small measurement range; (4) complex peripheral circuits, difficult to integrate sensor arrays

Method used

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Embodiment Construction

[0029] Below in conjunction with specific embodiment, further illustrate the present invention. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the teachings of the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope defined by the appended claims of the present application.

[0030] refer to figure 1 and refer to figure 2 , the sensor described in the present invention is mainly composed of a top layer 1 , a driving electrode 2 , an intermediate layer 3 , a sensing electrode 4 and a bottom layer 5 . in:

[0031] The top layer 1 and the bottom layer 5 are PCB boards with a square shape and a size of 1cm×1cm, but not limited to this shape and size. Here, PCB boards are used to facilitate the coupl...

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Abstract

The invention discloses a three-dimensional interface stress sensor which mainly solves the problem of the prior art that the three-dimensional interface stress cannot be measured in the real time. The three-dimensional interface stress sensor comprises a top layer (1), a driving electrode (2), a middle layer (3), a sensing electrode (4) and a bottom layer (5), wherein the driving electrode (2) is coupled on the bottom surface of the top layer (1); the middle layer (3) consists of four separating pillars (31, 32, 33 and 34) which are fixed between the top layer (1) and the bottom layer (5); the sensing electrode (4) consists of a Z-direction sensing electrode (41), an X-direction sensing electrode (42) and a Y-direction sensing electrode (43); the Z-direction sensing electrode (41) is coupled in the middle of the upper surface of the bottom layer (5); and the X-direction sensing electrode (42) and Y-direction sensing electrode (43) are respectively coupled on two adjacent sides of the upper surface and are vertical to each other. The three-dimensional interface stress sensor has the advantages of small geometric dimension, large measurement range, high sensitivity and easy integration, can realize real-time measurement of the three-dimensional interface stress and can be used for rehabilitation medicine, orthopedic surgery, athletic training and shoemaking industry.

Description

technical field [0001] The invention belongs to the technical field of electronic devices, and in particular relates to a three-dimensional interface stress sensor, which can be used to measure the interface stress distribution between the amputated limb surface and the interface of the artificial limb and the plantar interface stress distribution in the artificial limb. Background technique [0002] The interface stress sensor is considered to be a key device for measuring the interface stress distribution between the amputated surface and the interface of the artificial limb and the plantar interface stress distribution in the prosthesis, and is widely used in rehabilitation medicine, orthopedics, sports training and shoemaking. [0003] The surface stress distribution between the amputation surface and the prosthetic interface is considered a new research topic in medical engineering. According to estimates by the World Health Organization, people with disabilities in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01L1/14
Inventor 吕晓洲
Owner XIDIAN UNIV
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