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Substrate carrier for mounting substrates

A substrate carrier and substrate technology, which is used in semiconductor devices, semiconductor/solid-state device manufacturing, gaseous chemical plating, etc., can solve problems such as being unsuitable for high-temperature processes, and achieve the effect of uniform temperature change curve and short process time.

Inactive Publication Date: 2013-01-02
ROTH & RAU B V
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Inserts are constructed of semi-crystalline polymers that are not suitable for high temperature processes

Method used

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  • Substrate carrier for mounting substrates
  • Substrate carrier for mounting substrates

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Embodiment Construction

[0019] exist figure 1 , a substrate carrier according to an embodiment is shown in a perspective view from above. The substrate carrier basically consists of a lower carrier frame 1 and a substrate holder 2 lying flat on the carrier frame 1 . For example 5×5 recesses in the form of openings 3 are machined into the substrate holder 2, said recesses having lateral brackets 4 for holding rectangular solar cell crystals with dimensions 156×156 mm in dimensions 158×158 mm. Circle 5. exist figure 1 Only the solar cell wafer 5 is placed in the lower opening 3 . The plate-shaped substrate holder 2 has a thickness of 1.2 mm, and the bracket 4 is sunk by 0.5 mm relative to the upper side of the substrate holder 2 so that the solar cell wafer 5 is reliably positioned in the opening 2 with a thickness of 0.5 mm.

[0020] The substrate holder 2 covers the carrier frame 1 as a whole, so that the heat source arranged above is shielded. If required, the lateral regions of the carrier fra...

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Abstract

The invention relates to a substrate carrier for mounting substrates, comprising a carrying frame (1) and at least one substrate receptacle (2). The carrying frame (1) has a self-supporting and flexurally rigid frame structure made of longitudinal ribs (6) and transverse ribs (7), which are disposed at an angle to each other and made of a material that is dimensionally stable up to 800 C. The substrate receptacle (2) rests on the carrying frame (1) and has a plate-like design such that the solar cell wafers (5) can be positioned on the upper side of the substrate receptacle (2). Thermally insulating elements (9) are present between the carrying frame (1) and the substrate receptacle (2). The elements of the carrying frame (1) and the substrate receptacle (2) are made of steel, titanium, aluminum, ceramic, CFC (CFC = carbon fiber reinforced carbon) or composites made thereof.

Description

technical field [0001] The invention relates to a substrate carrier for holding one or more substrates, in particular for solar cell wafers during transport and during the individual process steps in a process chamber with a coating process and / or an etching process keep it up. Background technique [0002] When using a coating process and / or an etching process to process a substrate, it is required to adjust the special temperature and pressure of the specific environment. In this case, the processes generally also act on all surfaces in the process chamber, in addition to the surfaces of the substrate on which the individual processes are to affect specifically in a technically provided manner. According to the prior art, attempts are made to arrange the substrate and device system inside the process chamber in such a way that the individual processes act at least predominantly on specific substrate surfaces. Simple measures are often used in practice—namely, covering de...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L31/18H01L21/67363H01L21/6734C23C16/4583H01L21/67336C23C16/54H01L21/68778H01L21/67383H01L21/68735H01L21/68757
Inventor 马里奥・普吕斯特尔斯特凡・舒伯特赫尔曼・施莱姆马蒂亚斯・乌利希安德烈・卢克斯丹尼尔・德克尔西尔维娅・克劳特瓦尔德
Owner ROTH & RAU B V
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