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COB (chip on board)-LED module and production process

A COB-LED and module technology, which is applied in the field of COB-LED modules and production technology, can solve problems such as maintenance, inconvenient installation, complex structure, etc., to achieve convenient installation and operation, reduce invisible damage, and reduce defective rate Effect

Inactive Publication Date: 2015-02-18
KINGSUN OPTOELECTRONIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Its weak point is: due to the overall structure of the structure, it is inconvenient to maintain and install
Its weak point is: structure is too complicated, makes maintenance, installation inconvenient

Method used

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  • COB (chip on board)-LED module and production process

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Effect test

Embodiment Construction

[0031] The present invention will be described in further detail below in conjunction with accompanying drawing:

[0032] see figure 1 As shown, the COB-LED module is composed of an electrical interface bracket 3 between the conical reflector 1 and the radiator 2 and a COB-LED module 4 fixed by the electrical interface bracket 3 .

[0033] In this embodiment, the electrical interface bracket 3 is symmetrically opened by the ring frame 31, the screw holes 311 symmetrically opened on the ring frame 31, and the bottom of the ring frame perpendicular to the ring frame screw holes 311 for the COB-LED module 4 to pass through. The groove 312 of the ring frame inner hole 313 is composed of a slot 314 recessed radially symmetrically along the hole and a positioning groove 315 communicated with the slot 314 along one side of the slot 314 in a ring shape.

[0034] In this embodiment, the edges of the bottom opening of the conical reflective cup 1 protrude outward symmetrically along th...

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Abstract

The invention relates to a COB (chip on board)-LED module and a production process. The COB-LED module comprises an electrical interface support and a COB-LED module body, wherein the electrical interface support is arranged between a conical reflection cup and a radiator, and the COB-LED module body is fixed by the electrical interface support. The production process of the COB-LED module includes: welding two single-core sockets on the COB-LED module body, and plugging two single-core-wire interfaces onto the sockets of the COB-LED module body correspondingly to complete electrical connection; sleeving the electrical interface support on the COB-LED module body, and penetrating two screws through screw holes of the electrical interface support, open slots of the COB-LED module body and through holes of the radiator respectively prior to completing LED fixation and radiating; aligning fasteners at the bottom of the conical reflection cup with slots of the electrical interface support, and rotating the fasteners in place along locating slots on one sides of the slots to complete optical mechanical interface location; and fixing an anti-dazzle barrel-shaped shell on the radiator by means of screwing.

Description

technical field [0001] The invention relates to a lamp, in particular to a COB-LED module and a production process. Background technique [0002] CN201020655425.3 announced an LED downlight, its purpose is to provide a heat-conducting silicone grease coating on the bottom of the COB module, using the reflective cursor of the downlight to dissipate heat, the heat dissipation effect is good, and the temperature of the lamp cup can be effectively controlled at LED downlights within 60°C (at an ambient temperature of 25°C). The technical solution: The LED downlight comprises a cylindrical reflective cup, a COB module of LEDs is installed at the bottom of the cylindrical reflective cup, and a thermally conductive coating is provided on the side of the COB module that is in contact with the cylindrical reflective cup. Its weak point is: because this structural integral structure makes maintenance, installation inconvenient. The use of heat-conducting silicone grease coating for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V19/00F21V17/12F21V23/00F21Y101/02
Inventor 李善良
Owner KINGSUN OPTOELECTRONIC CO LTD
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