Rotating and buckling type electronic chip detection jig

Abstract

The invention relates to the technical field of electronic testing equipment, in particular to a rotating and buckling type electronic chip detection jig. A chip accommodating cavity for testing an electronic chip is disposed on a jig bottom plate. A rotating and buckling pressing plate is disposed on the chip accommodating cavity. A rotating and pressing device is arranged on the rotating and buckling pressing plate. The bottom end of the rotating and pressing device is connected with a chip pressing block for pressing the electronic chip. When the detection jig is in use, the electronic chip is placed in the chip accommodating cavity. The chip accommodating cavity plays a positioning role for the electronic chip so as to avoid malposition. The rotating and buckling pressing plate is disposed on the jig bottom plate through a rotating and buckling device in rotating and buckling mode, and then the rotating and pressing device is rotated so as to enable the chip pressing block to smoothly press towards the electronic chip. Consequently, the upper end of the electronic chip is stressed uniformly, a detected portion of the electronic chip fully contacts with a detection probe, and detection results are accurate and reliable. In addition, the rotating and buckling type electronic chip detection jig has the advantages of being simple in structure, convenient to use and long in service life.

Description

technical field [0001] The invention relates to the technical field of electronic detection equipment, in particular to a spin-type electronic chip detection jig. Background technique [0002] In the 1990s, with the advancement of integration technology, the improvement of equipment and the use of deep submicron technology, LSI, VLSI, and ULSI appeared one after another. The integration of electronic chips continued to increase, and the requirements for integrated circuit packaging became stricter. increases, power consumption also increases. In order to meet the needs of development, on the basis of the original packaging varieties, electronic chips have added a new variety - ball grid array packaging, referred to as BGA (Ball Grid Array Package). At present, various electronic chips are widely used in various industries in the electronic field: computer , mobile phone, computer north-south bridge, Mp3, MP4, DVD, DVB, printer, communication terminal, industrial control mot...

AI Technical Summary

Problems solved by technology

[0003] Electronic chips usually need to be tested in the selection of factory quality inspection, recycled product inspection, and performance testing. Usually, the detection fixture includes a jig bottom plate with a detection circuit, and a detection base is fixed on the jig bottom plate. The detection probe connected to the detection circuit and matched with the electronic chip is set on the bottom plate of the fixture; when testing, the electronic chip is placed on the detection base, and the detection probe is in contact with the detection point of the corresponding electronic chip. A simple pressing block on the upper end presses the chip or sometimes the chip is welded on the detection base so that the chip can be tested against the detection probe. Some parts cannot be in contact with the detection probe, resulting in inaccurate detection results. In addition, the way of welding and fixing is complicated, and it is easy to cause damage to the electronic chip and the detection base

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