Outgoing line via overlap structure of capacitive touch screen and production method of outgoing line via overlap structure

Abstract

The invention provides an outgoing line via overlap structure of a capacitive touch screen. A touch function area of the capacitive touch screen is in a single-layer structure. Vias of outgoing lines from an induction layer pattern are overlapped by the aid of an insulating layer and leads. Blank areas are preserved on the insulating layer at the overlap positions of the outgoing lines of the induction layer pattern and the leads. One blank area corresponds to the overlap of one outgoing line of the induction layer pattern and one lead. The leads and the outgoing lines of the induction layer pattern are disposed on two sides of the insulating layer respectively and are communicated by overlapping by the aid of the blank areas preserved on the insulating layer. The invention further provides a production method of the outgoing line via overlap structure. An induction layer and a drive layer of the touch function area are separated by the outgoing line via overlap, the number of the outgoing lines is reduced greatly, and the use of large-sized flexible circuit board solutions or multiple flexible circuit board solutions is avoided. The process difficulty in hot-pressing overlapping with the flexible circuit board is lowered, the yield is increased, the cost is lower, and the performances are not lowered.

Description

technical field [0001] The invention relates to a capacitive touch screen with a single-layer structure, in particular to a lead wire via hole overlapping structure of the capacitive touch screen and a manufacturing method thereof. Background technique [0002] With the popularization of capacitive touch screens, low cost and thinner products have become the development trend of capacitive touch screens, and the single-layer structure can achieve the above goals. [0003] At present, the commonly used single-layer structure is mainly divided into metal bridging scheme and non-bridging scheme. Both schemes realize the sensing layer graphics and driving layer graphics on a single optical conductive layer. Among them, the metal bridging scheme is more commonly used, and the biggest disadvantage is The bridging position is within the window area, and the metal is visible at a specific angle, which affects the visual effect. Secondly, the metal bridging solution is costly and the...

AI Technical Summary

Problems solved by technology

[0003] At present, the commonly used single-layer structure is mainly divided into metal bridging scheme and non-bridging scheme. Both schemes realize the sensing layer graphics and driving layer graphics on a single optical conductive layer. Among them, the metal bridging scheme is more commonly used, and the biggest disadvantage is The bridging position is within the window area, and the metal is visible at a specific angle, which affects the visual effect. Secondly, the metal bridging solution is costly and the yield rate is low; the other non-bridging solution uses the operation of the driver chip to distinguish the sensing layer from the driver. layer, but the number of lead wires is large, reaching 100 or even more. Generally, the following two methods are used to realize the connection with the chip:

[0004] 1. Large-size flexible circuit board lapping scheme: make metal lapping pins corresponding to the number of lead-out lines on the large-size flexible circuit board. Due to the excessive number of lead-out lines and lapping pins, anisotropic conductive adhesive is used When the hot pressing process is lapped, the flatness and accuracy cannot meet the needs of mass production

[0005] 2. Multiple flexible circuit board lapping scheme: use two or more flexible circuit boards to reduce the number of metal lapping pins on a single flexible circuit board. The biggest disadvantage of the problem encountered in solution 1 is multiple A flexible circuit board needs to be hot-pressed many times, and the cost is high

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