Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

XY motion platform driven by double-layer linear motor

A technology of linear motors and motion platforms, applied in the direction of multiple motor speed adjustments, circuits, electrical components, etc., can solve the problems of large structure size, small platform drive capacity, high manufacturing cost, etc., and achieve high motion acceleration and speed, structure The effect of compact size and low production cost

Inactive Publication Date: 2012-10-10
HARBIN INST OF TECH
View PDF5 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there are four main disadvantages of the traditional XY motion platform: first, the driving capacity of the platform is small; second, due to the use of mechanism coupling, the mass and volume of the moving parts are large; Space utilization; Fourth, more parts are used, assembly adjustment is more complicated, and manufacturing cost is higher

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • XY motion platform driven by double-layer linear motor
  • XY motion platform driven by double-layer linear motor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0026] The present invention will be further explained in conjunction with the drawings:

[0027] Reference figure 1 , figure 2 As shown, a double-layer linear motor driven XY motion platform includes: base plate assembly 1, X-axis linear motor assembly 2, motion platform assembly 3, Y-axis linear motor assembly 4, base plate 5, X-axis grating ruler reading head 6, X-axis grating scale reading head angle 7, X-axis precision motion guide 8, Y-axis linear motor mover 9, Y-axis linear motor stator and housing 10, Y-axis linear motor mounting seat 11, Y-axis grating ruler reading head 12, Y-axis grating ruler reading head angle frame 13, X-axis grating ruler frame 14, X-axis motion connecting frame 15, Y-axis grating ruler frame 16, Y-axis motion connecting frame 17, Y-axis precision motion guide 18, X-axis linear motor mover 19. X-axis linear motor mounting base 20, X-axis linear motor stator and housing 21.

[0028] The connection mode of the components of the XY motion platform d...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an XY motion platform driven by a double-layer linear motor. The XY motion platform comprises a bottom plate component (1), an X-axis linear motor component (2), a motion platform component (3), a Y-axis linear motor component (4), a bottom plate (5), an X-axis grating scale reading head (6), an X-axis precision motion guide rail (8), a Y-axis linear motor rotor (9), a Y-axis grating scale reading head (12), a Y-axis precision motion guide rail (18), an X-axis linear motor rotor (19) and the like. The XY motion platform driven by the double-layer linear motor has high driving capacity, high motion speed, reasonable linear motor decoupling mode and small structure size, and is suitable for high-speed packaging operation of a semiconductor integrated chip performed on a production line and in other narrow spaces.

Description

Technical field [0001] The present invention relates to semiconductor chip packaging equipment, and in particular to an XY with greater drive capability, faster motion speed, more reasonable linear motor decoupling mode, and smaller structure size compared with traditional XY motion platforms. The motion platform is suitable for high-speed packaging of semiconductor integrated chips in narrow spaces such as production lines. Background technique [0002] In the field of semiconductor chip packaging, the general drive structure of the traditional XY motion platform is an ordinary linear motor, that is, a set of linear motor has only one set of stator and mover mechanism, and the drive capacity is small; the connection mode is mechanism coupling, that is, one The overall drive mechanism in one direction, together with the clamping mechanism and the load, is completely carried on the drive in the other direction, and becomes the load driven in the other direction. Therefore, the tr...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L21/67H02P5/48
Inventor 刘延杰宋磊刘武龙
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products