Opto-electric hybrid board and manufacturing method therefor

Abstract

Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit (W) having an optical element (10) mounted thereon. The optical waveguide unit (W) includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit (E) includes bent portions (15)which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions (15) are located at predetermined locations with respect to the optical element. The optical waveguide unit (W) and the electric circuit unit (E)are coupled in a state in which the bent portions (15) fit into the socket portions( 4).

Description

technical field [0001] The present invention relates to a photoelectric hybrid substrate having an optical waveguide unit and a circuit unit on which optical elements are mounted and a manufacturing method thereof. Background technique [0002] In recent electronic equipment and the like, as the amount of information to be transmitted increases, optical wiring is used in addition to electrical wiring. That is, an opto-electric hybrid board having a circuit unit and an optical waveguide unit in which a light-emitting element for converting an electrical signal into an optical signal is mounted on a circuit board on which electrical wiring is formed is incorporated in the above-mentioned electronic equipment, etc. and an optical element such as a light receiving element for converting an optical signal into an electrical signal; the optical waveguide unit is formed with an optical waveguide as an optical wiring for transmitting the above-mentioned optical signal. [0003] In ...

AI Technical Summary

Problems solved by technology

[0007] However, in the alignment method of the above-mentioned Patent Document 1, although high-precision alignment can be performed, it is time-consuming and labor-intensive, and lacks in mass production.

In addition, in the centering method of the above-mentioned Patent Document 2, although the alignment can be performed by a simple method such as fitting the hole and the pin, not only dimensional error occurs when the connector and the pin are separately manufactured, but also the connector Due to the positional deviation with respect to the mounting position of the optical waveguide unit, and the positional deviation of the positioning pins with respect to the mounting position of the circuit unit, these dimensional errors and positional deviations accumulate, and the alignment accuracy deteriorates.

Therefore, when it is desired to improve the alignment accuracy, it is necessary to manage the dimensional accuracy so that the above-mentioned dimensional error and positional deviation do not occur, so the cost is increased, and the mass production is lacking.

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