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Reflow soldering equipment

A reflow soldering and equipment technology, which is applied in metal processing, electrical components assembly printed circuit, etc., can solve the problems of easy deformation, board dropping, and unstable transportation, etc., and achieve the effect of improving board dropping, reducing energy consumption, and facilitating transportation

Active Publication Date: 2012-09-26
SUNEAST ELECTRONICS TECH SHENZHEN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: to provide a reflow soldering equipment, which can effectively utilize the production site, save floor space, reduce energy consumption, facilitate transportation, and improve the easy deformation of the transportation guide rail after heating, resulting in board drop and transportation Unsteady problem

Method used

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Examples

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Embodiment Construction

[0024] Refer below Figure 2-Figure 4 Describe in detail an embodiment of the tower reflow furnace provided by the present invention; as shown in the figure, this embodiment mainly includes a plurality of temperature zones 1 and a PCB transmission mechanism 2 for transferring PCB boards in the multiple temperature zones 1 Among the multiple temperature zones 1, at least two temperature zones 11, 13 are arranged vertically up and down, and the PCB transmission mechanism 2 at least includes a vertical transmission guide rail 21 for vertically transporting PCBs between the temperature zones arranged up and down. .

[0025] In addition, the PCB transmission mechanism 2 also includes a horizontal transmission guide rail (not shown in the figure) for horizontally transporting the PCB in each temperature zone 2 .

[0026] In addition, the entrance and exit of each temperature zone 1 are respectively provided with a plate picking mechanism 31 and a plate pushing mechanism 32 for pick...

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Abstract

The invention discloses reflow soldering equipment which comprises a plurality of warm areas and a PCB (printed circuit board) drive mechanism for transmitting PCB boards in the warm areas, at least two warm areas are arranged along the vertical direction and from up to down, and the PCB drive mechanism at least comprises an vertical transmission guide for transmitting PCB boards among the warm areas arranged from up to down. The reflow soldering equipment can effectively utilize the production site, save the floor area, reduce the energy consumption, provide convenience for the transmission, and solve the problem that the after the transmission guide is heated, the distortion is easy to occur such that the PCB boards may be dropped and the transmission is not steady.

Description

technical field [0001] The invention relates to the field of electronic circuit surface assembly equipment, in particular to a reflow soldering equipment. Background technique [0002] Electronic circuit surface mount technology (Surface Mount Technology, SMT), also known as surface mount or surface mount technology. It is a surface mount component (Surface Mounted component, SMC) or surface mount device (Surface Mounted Devices, SMD) without pins or short leads, also known as a chip component, mounted on a printed circuit board (Printed Circuit Board) , PCB) or the surface of other substrates, by reflow soldering or dip soldering and other methods to solder and assemble the circuit assembly technology. Its main technological process is: printing--SMD--welding--overhaul (testing links can be added to each process to control quality). Among them, the soldering process mainly uses reflow soldering equipment for soldering. [0003] Reflow soldering equipment, also known as "...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/00H05K3/34
Inventor 时曦徐晓芹
Owner SUNEAST ELECTRONICS TECH SHENZHEN
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