LED packaging structure
一种LED封装、LED芯片的技术,应用在电气元件、电固体器件、电路等方向,能够解决荧光粉激发效果降低、演色性不佳、出光颜色不均匀等问题
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0011] The present invention will be described in detail below in conjunction with the accompanying drawings.
[0012] see figure 1 as well as figure 2 , shows the LED packaging structure 10 of the present invention, which includes a substrate 12 , a reflective cup 14 , an encapsulant 16 and an LED chip 18 .
[0013] The substrate 12 has a top surface 122 with two electrodes 120 on the top surface 122 . The two electrodes 120 extend from the top surface 122 to the bottom surface 124 opposite to the top surface 122 . One of the two electrodes 120 is a positive electrode and the other is a negative electrode. The reflecting cup 14 is disposed on the top surface 122 and surrounds the periphery of the substrate 12 , and a groove 1220 is formed on the top surface 122 . The LED chip 18 is disposed at the bottom of the groove 1220 and is electrically connected to the two electrodes 120 through conductive wires 182 . After the LED chip 18 is electrically connected, the light emi...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com