Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Low-voltage packaging process of circuit board electronic component

A technology of electronic components and packaging technology, applied in the field of manufacturing technology, can solve problems such as difficult control of shape, poor effect of circuit board, irregularity, etc.

Inactive Publication Date: 2012-08-15
SUZHOU KONIG ELECTRONICS TECH CO LTD
View PDF2 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The shape of the cured circuit board produced by this type of encapsulation method is not easy to control and irregular, and chemical potting such as UV, epoxy, PU, ​​glue, etc. has poor effect on the encapsulation (ie bonding) of the circuit board. Size cannot be controlled

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The preferred embodiments of the present invention are described in detail below, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0013] The present invention describes a low-voltage packaging process for circuit board electronic components, comprising the following steps:

[0014] (1) Clean the surface of the circuit board that needs to be packaged to achieve surface cleaning and provide surface energy;

[0015] (2) Put the processed circuit board into the mold, add encapsulation additives for pressure curing, so as to realize the encapsulation of electronic components on the circuit class;

[0016] (3) Remove the packaged circuit board electronic components.

[0017] Further, the additive in step 2 is hot melt adhesive.

[0018] Further, the injection molding pressure processed in step 2 is 0.1-100 bar.

[0019] Furth...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a low-voltage packaging process of a circuit board electronic component. The low-voltage packaging process comprises the following steps of: processing a circuit board needing to be packaged, realizing surface cleanness and providing surface energy; placing the processed circuit board in a mould, adding a packaging additive for pressurizing solidifying so as to realize packaging the electronic component on the circuit board; and taking the packaged electronic component on the circuit board. The low-voltage packaging process is high in packaging efficiency by adopting low-pressure injection molding packaging; the electronic component can not be damaged; the electronic component is complete in appeanrce during molding, and is easy to control; a part needing being packaged of the electronic component is completely packaged; and functions of sealing, moisture proofing, water proofing, dust proofing and chemical corrosion resistance are achieved for the molded part.

Description

technical field [0001] The invention relates to a manufacturing process, in particular to a low-voltage packaging process for circuit board electronic components. Background technique [0002] The encapsulation methods in the prior art mainly include: UV, epoxy, PU, ​​glue and other chemical potting. The implementation steps of this type of chemical potting are as follows: the first step is to fix the existing electronic component circuit board in a special tool, and dispensing glue through special equipment; the second step is to use special light source equipment and other heating equipment. Curing, one-time encapsulation of the circuit board. The shape of the cured circuit board produced by this type of encapsulation method is not easy to control and irregular, and chemical potting such as UV, epoxy, PU, ​​glue, etc. has poor effect on the encapsulation (ie bonding) of the circuit board. Size cannot be controlled. Contents of the invention [0003] The purpose of the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/28
Inventor 朱建晓沈阳
Owner SUZHOU KONIG ELECTRONICS TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com