Processing method of glass fibre board

Abstract

The invention belongs to a processing method of a glass fibre board. When the glass fibre board is processed, the glass fibre board is drilled and then countersunk after the drilling is ended. The surface layer of the glass fibre board is of 2116 fabric. According to the processing method disclosed by the invention, the hole shift problem can be effectively improved, and the precision of a drilled hole is improved; in addition, after a finished product is completed, the easy-to-measure degree of the glass fibre board can be promoted aiming at a power test field.

Description

technical field [0001] The invention belongs to a PCB bare board processing method, in particular to a glass fiber board processing method. Background technique [0002] At present, when manufacturing PCB boards, one of them is an epoxy glass fiber cloth-based printed board. According to the thickness of the glass fiber and the difference in warp and weft yarn bundles, the model of the glass fiber cloth is mainly 7628, because the 7628 cloth type Its fiber is larger, it is easier to meet the customer's plate thickness requirements, and the cost is lower; however, the use of 7628 PP cloth, because the glass fiber is too large, is prone to drilling deviation during the drilling process, resulting in electrical testing. The test fails and other issues. The currently used drilling method is sinking first and then drilling. In general design, there will be no problem with this process. However, if you encounter a dense PCB with a ball grid array structure, there are many sinking...

AI Technical Summary

Problems solved by technology

[0002] At present, when manufacturing PCB boards, one of them is an epoxy glass fiber cloth-based printed board. According to the thickness of the glass fiber and the difference in warp and weft yarn bundles, the model of the glass fiber cloth is mainly 7628. This is because the 7628 cloth type Its fiber is larger, it is easier to meet the customer's plate thickness requirements, and the cost is lower; however, the use of 7628 PP cloth, because the glass fiber is too large, is prone to drilling deviation during the drilling process, resulting in electrical testing. The test failed and other problems

The currently used drilling method is sinking first and then drilling. In general design, there will be no problem with this process. However, if you encounter a dense PCB with a ball grid array structure, there are many sinking holes, so after that The drilling hole will cause the hole deviation phenomenon due to the insufficient residual thickness stress after the glass fiberboard is countersinked.

For glass fiber boards without copper clad laminates, the drilling parameters used in the past should be further adjusted, and the parameters used for general PCB drilling cannot be used.

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