Manufacturing method of multilayer circuit board and laminated structure for multilayer circuit board

Abstract

The embodiment of the invention discloses a manufacturing method of a multilayer circuit board and a laminated structure for the multilayer circuit board, relating to the field of circuit board manufacturing, and being capable of effectively improving the uniformity of the thickness of an insulating layer. The manufacturing method of the multilayer circuit board comprises the following steps of: forming a conductive column layer for electrically connecting adjacent circuit layers; stacking a prepreg and a release film on the conductive column layer in turn, and laminating to form the insulating layer, wherein the thickness of the release film is 200 to 500 microns; and manufacturing a circuit layer on the insulating layer. The manufacturing method can be used for manufacturing the multilayer circuit board.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a multilayer circuit board. Background technique [0002] Multi-layer circuit board is the product of the development of electronic technology in the direction of high speed, multi-function, large capacity and small volume. As the name implies, a multi-layer circuit board includes multiple layers of circuit layers superimposed on each other, an insulating layer is provided between two adjacent circuit layers, and the connection between the circuit layers of each layer is realized through the via holes or conductive pillars passing through the insulating layer. electrical connection. [0003] In the production process of high-performance packaged multilayer circuit boards, conductive pillars (usually copper pillars) are generally used to realize the electrical connection between the circuit layers of each layer, and the purpose of increasing t...

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Problems solved by technology

[0004] In the lamination method in the prior art, on the one hand, if the thickness of the prepreg is small, the uniformity of the thickness of the insulating layer is poor, and defects such as lamination depressions and white spots are prone to appear on the surface of the insulating layer.

On the other hand, because the thickness of the prepregs to be stacked needs to ensure that the insulating layer is fully filled and no voids will occur, the thickness of the prepregs to be stacked is relatively thick. Generally speaking, the thickness of the prepregs to be stacked is thicker than The thickness of the insulating layer requires more than double the upper limit, and the thickness of the prepreg stacked in the lamination process directly affects the number of times the subsequent insulating layer is ground and the uniformity of the thickness of the insulating layer. Therefore, the lamination method of the prior art requires The stacked semi-cured is thicker, and the subsequent insulating layer needs to be ground more often, resulting in higher production costs

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