Method for detecting slip during linear delivery of wafer by using image processing technology

Abstract

The invention discloses a method for detecting slip during the linear delivery of a wafer by using an image processing technology. The method comprises the following steps: S1, mounting a video camera above a wafer delivering manipulator, and marking the wafer and the tail end actuator of the manipulator; S2, shooting the contraction and the extending states of the manipulator through the video camera, trimming the marks according to the shot images, and then obtaining a linear wafer delivering video of the manipulator through the video camera; S3, calculating the position of the wafer in each frame of the video on the basis of the geometrical optics fundamental principle and a CCD (charge-coupled device) pixel distribution parameter; and S4, analyzing and contrasting the change of the positions of the wafer relative to the manipulator frame by frame, and calculating and fitting to obtain a slip time history curve. The method can meet the requirements for detecting slip under different accuracy classes, and provide a theoretic and experimental reference for optimizing and controlling the speed and the acceleration of the wafer delivering manipulator, so as to achieve higher transmission efficiency under the premise that the delivering accuracy is met.

Description

technical field [0001] The invention relates to a wafer transmission system in the manufacture of integrated circuits (IC), in particular to a method for detecting the slippage in the linear transmission of the wafer by using image processing technology. Background technique [0002] Wafer transfer system is an essential part of integrated circuit (IC) manufacturing, and its transfer accuracy directly affects the accuracy of integrated circuit (IC) process. Most of the existing research focuses on improving the positioning accuracy of the manipulator responsible for wafer transfer, but there is no method for precisely detecting the amount of wafer slippage during the transfer process. Therefore, the only way to ensure a sufficiently small amount of slippage is by intuitively limiting the speed or adding an additional clamping mechanism, resulting in a lack of effective theoretical and experimental basis for optimal control of the speed and acceleration of the manipulator. ...

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to solve the problem of the lack of accurate detection of wafer slippage during the wafer transfer process, and propose a method for detecting the slippage amount in the straight-line transfer of the wafer using image processing technology, so as to determine the speed of the wafer transfer process by the manipulator. , Acceleration optimization control provides powerful theoretical and experimental basis

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