Electronic equipment and heat radiation device thereof

Abstract

The invention relates to electronic equipment which comprises a shell, a circuit board placed inside the shell, a heating electronic element on the circuit board, and a heat radiation device arranged at one end of the shell, wherein the heat radiation device comprises a fan module and a fixing rack for fixing the fan module on the shell; the shell comprises a first sidewall and a second sidewall which are oppositely arranged, and a flow channel is formed between the first sidewall and the second sidewall; the heating electronic element is located in the flow channel; the fan module comprises a first fan and a second fan which are arranged side by side; the fixing rack is used for fixing the fan module at one ends of the first sidewall and the second sidewall; and a first through hole and a second through hole which are respectively corresponding to the first fan and the second are formed on the fixing rack, and the gas flows of the first fan and the second fan can pass through the first through hole and the second through hole so as to enter the flow channel. The electronic equipment also comprises a windshield which is rotatably connected to the fixing rack, wherein the windshield rotates around the fixing rack and shields the through hole corresponding to the fan in a non-operation state so as to avoid backflow at the position when any one of the first fan and the second fan is in a non-operation state.

Description

technical field [0001] The invention relates to an electronic device and a heat dissipation device arranged in the electronic device, in particular to a heat dissipation device with a windshield. Background technique [0002] The power and calorific value of existing electronic devices such as servers have risen sharply, so the heat dissipation requirements are also getting higher and higher. These electronic devices are generally equipped with a fan module to provide forced cooling airflow to cool the heat-generating electronic components in the electronic device. Compared with other heat dissipation devices such as heat sinks, the reliability of the fan is poor, and a single fan in a fan module often fails. And the part where a single fan fails will cause the phenomenon of air flow backflow due to the loss of air pressure, thus causing the cooling air flow to fail to flow in a predetermined direction. As a result, the heated electronic components cannot be cooled effecti...

AI Technical Summary

Problems solved by technology

Compared with other heat dissipation devices such as radiators, the reliability of fans is poor, and there are often cases where a single fan in a fan module fails

The part where a single fan fails will cause the phenomenon of air flow backflow due to the loss of air pressure, which will cause the cooling air flow to fail to flow in the predetermined direction

As a result, the heating electronic components cannot be effectively and timely cooled, and the heat dissipation of the entire electronic equipment will deteriorate sharply, which may even lead to serious consequences such as the failure of some electronic components.

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