Device for preparing diamond wire saw and method for preparing diamond wire saw by device

Abstract

The invention discloses a device for preparing a diamond wire saw and a method for preparing the diamond wire saw by the device. The device for preparing the diamond wire saw comprises a cope plating bath, wherein the cope plating bath contains a mixture of diamond particles and a first plating solution, and a conveyor belt used for keeping uniform movement of at least partial diamond particles is provided in the cope plating bath, wherein the cope plating bath is used for electrodepositing diamond particles on the surface of a core wire and simultaneously forms a binding layer on the surface of the core wire, the binding layer is used for fixing the diamond particles on the surface of the core wire; and a thicken plating bath, wherein the thicken plating bath is positioned at the downstream of the cope plating bath, the thicken plating bath contains a second plating solution, the thicken plating bath is used for increasing the thickness of the binding layer formed on the surface of the core wire during the cope process.

Description

technical field [0001] The invention belongs to the field of materials, in particular to the field of manufacturing diamond wire saws. Background technique [0002] At present, the diamond consolidation technology of consolidated abrasive diamond wire saw mainly includes: mechanical rolling method, electroplating method, etc. Among them, the electroplated diamond wire saw uses electroplated metal as the binder, and the diamond abrasive with high hardness and high wear resistance is firmly consolidated on the surface of the core wire through the electrodeposition of the electroplated metal. The general manufacturing process of electroplated diamond wire saw mainly includes sanding, thickening and post-processing. [0003] In the existing technology, sanding and thickening are usually carried out in the same electroplating tank. During the sanding process, since diamond is a poor conductor, it is not easy to co-plate with metal. In order to ensure the coverage of diamond par...

AI Technical Summary

Problems solved by technology

During the sanding process, since diamond is a poor conductor, it is not easy to co-plate with metal. In order to ensure the coverage of diamond particles on the surface of the core wire, the moving speed of the core wire must be very slow, mostly lower than 10m / min. At the same time, the initial stage of sanding The combination of diamond particles and the core wire is not firm. In order to avoid the diamond particles being washed off by the electroplating solution, the electroplating solution should not be strongly stirred, and severe ultrasonic vibrations should not be applied, and electroplating methods such as brush plating and other fast-growing coatings should not be used. The growth rate is inhibited, the production efficiency is very low, and the cost of diamond wire saw remains high

In addition, there are still diamond particles embedded in the coating in the later stage of electroplating, but only a small part of these diamond particles are covered by the coating, and they are easy to fall off during use, which is ineffective abrasive grains and causes waste of diamond particles

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