Multi-channel small form-factor transceiver and assembly method

Abstract

The invention discloses a multi-channel small form-factor transceiver which comprises a circuit board, a heat sink substrate, semiconductor laser array chips or semiconductor diode receiving chips and coupling optical fiber, wherein the heat sink substrate is arranged on the circuit board, and the semiconductor laser array chips or semiconductor diode receiving chips are arranged on the heat sink substrate, are perpendicular to the optical fiber and can be used for directly aligning with the optical fiber for coupling, so that the distance from the optical fiber to the semiconductor laser chips is shortened, more light can be input into the optical fiber for transmission, and the problem of mutual interference among the semiconductor laser array chips due to distance is solved.

Description

technical field [0001] The invention relates to a multi-channel small-package transceiver and an assembly method, in particular to a multi-channel small-package transceiver with an improved structure and an assembly method. Background technique [0002] At present, the high-speed and high-bandwidth of ultra-large-capacity information is the development trend of communication networks. In many devices, the incident or outgoing direction of the optical signal is often perpendicular to the direction of the electrical signal. Take the quad small form-factor pluggable (QSFP, Quad Small Form-factor Pluggable) as an example, such as figure 1 As shown, the internal structure of the existing four-channel small-package transceiver 100' is to use a 45° filter 20' to coat the surface with a reflective film, so that the light is reflected at 90°, and the four semiconductor lasers or photodiode array chips 30' Aligned to array fiber 40' for transmission. This method completely relies o...

AI Technical Summary

Problems solved by technology

This method completely relies on the optical system to turn the optical path by 90 degrees so that it is in the same direction as the electrical signal. The disadvantages are high cost of optical components, high assembly precision requirements, and complicated processes.

Images