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Method and device for cutting brittle material substrate, and window glass for vehicles

A technology for brittle material substrates and glass plates, applied in glass cutting devices, fine working devices, glass production, etc., can solve problems such as unexplained cutting of substrates, and achieve excellent cross-sectional quality

Inactive Publication Date: 2011-11-30
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the invention described in Patent Document 1, the substrate is cut at a position behind the irradiation position in the moving direction.
That is, the method described in Patent Document 1 does not describe the case where the substrate is cut at a position forward in the moving direction from the irradiation position.

Method used

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  • Method and device for cutting brittle material substrate, and window glass for vehicles
  • Method and device for cutting brittle material substrate, and window glass for vehicles
  • Method and device for cutting brittle material substrate, and window glass for vehicles

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4

[0079] A 3.5 mm-thick green-based soda-lime glass plate (manufactured by Asahi Glass Co., Ltd.: glass substrate for automobiles) produced by the float method was prepared. Install the glass plate G on figure 1 stage 20 is shown. Next, the scriber 32 was pressed against the surface G1 of the glass plate with a force of 55N, and the scribed line L2 was drawn at a speed of 200 mm / sec. Such as Figure 4 As shown, the scribe line L2 successively has a first linear portion L2-1, a quarter arc portion L2-2, and a second linear portion L2-3. Table 1 shows the shape of the scribe line L2 in each of Examples 1-4. In addition, the said 1 / 4 arc-shaped part means the part which becomes 1 / 4 of a circle when drawing a circle using this arc (the same applies hereinafter).

[0080] [Table 1]

[0081]

[0082]

[0083] Next, the surface G1 of the glass plate G is irradiated with image 3 In the illustrated laser, the irradiation position A of the laser on the substrate surface G1 is...

Embodiment 5～7、 comparative example 3

[0094] In Examples 5-7 and Comparative Example 3, the scribe line L2 was formed similarly to Examples 1-4 except having formed the linear scribe line L2 in the center of the glass plate surface. Next, use figure 2 The indicated lasers cut the glass plate under the conditions described in Table 3. Table 3 shows the amount of glass shavings at the time of cutting and the evaluation results of the quality of the cut surface.

[0095] According to Table 3, in Examples 5 to 7, since the dimension W on the substrate surface G1 was set within the range of 2 to 10 mm, the quality of the fractured surface was good. On the other hand, in Comparative Example 3, the dimension W on the substrate surface G1 was too small at 1 mm. Therefore, the scribe line L2 is overheated, starting from the fine cracks when the scribe line L2 was formed, the cracks also propagate in the in-plane direction (X direction, Y direction), and the quality of the fractured surface deteriorates.

[0096] [table...

Embodiment 8～14、 comparative example 4～8

[0099] In Examples 8-14 and Comparative Examples 4-8, the scribe line L2 was formed similarly to Examples 5-7. Next, use figure 2 or image 3 The indicated lasers cut the glass plate under the conditions described in Table 4. Table 4 shows the amount of glass shavings at the time of cutting and the evaluation results of the quality of the cut surface.

[0100] According to Table 4, in Examples 8 to 14, the focusing angle α was set within the range of 10 to 34°. As a result, the quality of the fractured surface was good. On the other hand, in Comparative Examples 4 to 6, the focusing angle α was too small at 0° and 8°, and the quality of the fractured surface was lowered. This is estimated to be because the thermal stress difference between the substrate surface G1 and the substrate back surface G2 is too small. In addition, in Comparative Examples 7 to 8, the focusing angle α was too large at 60°, and the quality of the fractured surface deteriorated. It is estimated th...

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Abstract

A method of cutting a brittle-material plate is provided by which the brittle-material plate can be cut into a desired planar shape through automatic machine production without complicating the device. Also provided are a window glass for vehicles which is obtained by the cutting method and a device for cutting a brittle-material plate. The method of cutting a brittle-material plate comprises: a first step in which a scribe line (L2) is formed in a surface (G1) of a brittle-material plate (G); and a second step in which the position (A) where the surface (G1) of the brittle-material plate (G) is irradiated with laser light is relatively moved along the scribe line (L2) to cut the brittle-material plate (G) ahead of the irradiation position (A) with respect to the moving direction.

Description

technical field [0001] The invention is a method for cutting a brittle material substrate by irradiating laser light. Specifically, it relates to a cutting method of a brittle material substrate by relatively moving an irradiation position of a laser beam on the surface of a brittle material substrate along a scribe line to cut the brittle material substrate, a vehicle window glass obtained by the cutting method, and a brittle material substrate cutting device. Background technique [0002] Conventionally, it is known to form a scribe line on the surface of a brittle material substrate, relatively move the irradiation position of the laser beam along the scribe line when irradiating the surface of the brittle material substrate with laser light, and use a cooling device to cool the region heated by the laser to cut the brittle material substrate. A method of a material substrate (for example, refer to Patent Document 1). [0003] On the other hand, in the conventional bend...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03B33/04B23K26/00B23K26/38B28D5/00C03B33/09
CPCB28D5/04C03B33/091C03B33/04Y02P40/57C03B33/09B23K26/382B23K26/08
Inventor 深泽宁司松本彰则斋藤勲藤田早苗
Owner ASAHI GLASS CO LTD
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