Pulsation damper and grinding liquid supply system

Abstract

The invention provides a pulsation damper, which comprises a shell, wherein a liquid inlet and a liquid outlet are formed on the two sides of the shell respectively; a gas cavity is formed in the shell; the side wall of the gas cavity is formed by a telescopic film; the top surface and the bottom surface of the gas cavity are formed by a diaphragm and the bottom surface of the shell; one end of the telescopic film is fixed on the bottom surface of the shell, and the other end of the telescopic film is fixedly connected with the diaphragm; a central shaft and a central shaft sleeve are arranged in the gas cavity; the bottom surface of the central shaft sleeve is fixed on the bottom surface of the shell; an opening is formed on the top surface of the central shaft sleeve; the central shaft passes through the opening on the top surface of the central shaft sleeve; the first end of the central shaft is connected with the diaphragm, and the second end of the central shaft is positioned in the central shaft sleeve; a limiting tail end is arranged at the second end of the central shaft; the width of the limiting tail end is greater than the space of the opening on the top surface of the central shaft sleeve; and a gas inlet is formed on the bottom surface of the gas cavity and is used for introducing compressed gas into the gas cavity. The pulsation damper has a simple structure, hassmaller volume compared with other kinds of pulsation dampers and has an extremely good smooth pulsation effect.

Description

Technical field [0001] The invention relates to the technical field of chemical mechanical polishing in semiconductor manufacturing, in particular to a pulsation buffer and a polishing liquid supply system. Background technique [0002] Chemical mechanical polishing (CMP) is an indispensable process in chip processing. With the further development of semiconductor chip technology, mechanical grinding and polishing technology plays an important role, and the requirements for the quality and supply conditions of the grinding fluid itself are more stringent. [0003] In the slurry supply system, a pump is usually used to pump the slurry in the slurry storage container into the slurry supply pipeline, and finally the slurry is supplied to the grinding machine table. When the grinding fluid is being transported, when the pump is started and closed, the fluid will impact the grinding fluid supply pipeline, which will cause severe water hammer, that is, water hammer. At the same time, th...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a pulsation buffer to solve the problems of water hammer and pulsation when the pump pumps liquid into the pipeline

[0007] The technical problem to be solved by the present invention is to provide a grinding liquid supply system to solve the problems of water hammer and pulsation when pumping the grinding liquid to the pipeline

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