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Pulsation damper and grinding liquid supply system

A technology for supplying system and grinding fluid, applied in grinding/polishing equipment, pipes/pipe joints/fittings, metal processing equipment, etc., can solve problems such as pulsation and water hammer, achieve long life, smooth pulsation effect, eliminate The effect of pulsation

Active Publication Date: 2013-05-29
SEMICON MFG INT (SHANGHAI) CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a pulsation buffer to solve the problems of water hammer and pulsation when the grinding liquid supply system in the prior art pumps liquid to the pipeline
[0007] The technical problem to be solved by the present invention is to provide a grinding liquid supply system to solve the problems of water hammer and pulsation when pumping the grinding liquid to the pipeline

Method used

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  • Pulsation damper and grinding liquid supply system
  • Pulsation damper and grinding liquid supply system
  • Pulsation damper and grinding liquid supply system

Examples

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Embodiment Construction

[0023] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0024] The pulsation damper and grinding liquid supply system of the present invention can be widely applied in many processes, and can utilize various suitable materials to make, the following is to illustrate by preferred embodiment, certainly the present invention is not limited to For this specific embodiment, general replacements known to those skilled in the art undoubtedly fall within the protection scope of the present invention.

[0025] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of illustration, the schematic diagrams are not partially enlarged according to the general scale, which should not be used as...

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PUM

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Abstract

The invention provides a pulsation damper, which comprises a shell, wherein a liquid inlet and a liquid outlet are formed on the two sides of the shell respectively; a gas cavity is formed in the shell; the side wall of the gas cavity is formed by a telescopic film; the top surface and the bottom surface of the gas cavity are formed by a diaphragm and the bottom surface of the shell; one end of the telescopic film is fixed on the bottom surface of the shell, and the other end of the telescopic film is fixedly connected with the diaphragm; a central shaft and a central shaft sleeve are arranged in the gas cavity; the bottom surface of the central shaft sleeve is fixed on the bottom surface of the shell; an opening is formed on the top surface of the central shaft sleeve; the central shaft passes through the opening on the top surface of the central shaft sleeve; the first end of the central shaft is connected with the diaphragm, and the second end of the central shaft is positioned in the central shaft sleeve; a limiting tail end is arranged at the second end of the central shaft; the width of the limiting tail end is greater than the space of the opening on the top surface of the central shaft sleeve; and a gas inlet is formed on the bottom surface of the gas cavity and is used for introducing compressed gas into the gas cavity. The pulsation damper has a simple structure, hassmaller volume compared with other kinds of pulsation dampers and has an extremely good smooth pulsation effect.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing in semiconductor manufacturing, in particular to a pulsation buffer and a polishing liquid supply system. Background technique [0002] Chemical Mechanical Polishing (CMP) is an essential process in chip processing. With the further development of semiconductor chip technology, mechanical polishing technology plays an important role, and the requirements for the quality and supply conditions of the polishing liquid itself are also more stringent. [0003] In the grinding liquid supply system, a pump is usually used to draw the grinding liquid in the grinding liquid storage container into the grinding liquid supply pipeline, and finally supply the grinding liquid to the grinding machine table. When transporting abrasive liquid, when the pump starts and shuts down, the liquid impacts the abrasive liquid supply pipeline, which will produce instantaneous and strong impact on the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B57/02F16L55/045
Inventor 柴求军王怀锋余文军曹开玮
Owner SEMICON MFG INT (SHANGHAI) CORP
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