Batch test method and system for PCBA (Printed Circuit Board Assembly) of Bluetooth headset

A bluetooth earphone and batch testing technology, applied in the direction of measuring electricity, measuring devices, measuring electrical variables, etc., can solve the problems of low test efficiency, PCBA test equipment cannot be tested automatically, and achieve the effect of improving production test efficiency

Inactive Publication Date: 2011-11-16
GUANGZHOU LIWEI ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the technical problem that the prior art bluetooth earphone PCBA testing equipment cannot be automatically tested and the test efficiency is low, the present invention provides a bluetooth earphone PCBA batch testing method and system

Method used

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  • Batch test method and system for PCBA (Printed Circuit Board Assembly) of Bluetooth headset
  • Batch test method and system for PCBA (Printed Circuit Board Assembly) of Bluetooth headset
  • Batch test method and system for PCBA (Printed Circuit Board Assembly) of Bluetooth headset

Examples

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Embodiment Construction

[0029] See figure 1 and figure 2 . The Bluetooth headset PCBA batch test system includes a test computer, an electromagnetic simulator, a level conversion board, a test fixture and a Bluetooth high-frequency test shielding box. Wherein, the electromagnetic simulator is connected with the test computer through the GPIB line, the level conversion board is connected with the test computer through the USB line, and the electromagnetic simulator and the level conversion board constitute the test equipment. Because the test equipment is composed of an electromagnetic emulator and a level conversion board, the existing expensive bluetooth PCBA test instrument is replaced, and the cost is saved. The test computer has a built-in Xidong test control program for automatically controlling the test equipment to test the Bluetooth PCBA. The test fixture is used to fix the Bluetooth headset PCBA. The bluetooth high-frequency test shielding box is used to place the bluetooth headset PCBA...

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Abstract

The invention discloses a batch test method for a PCBA (Printed Circuit Board Assembly) of a Bluetooth headset, aiming at providing a batch test method of the PCBA of the Bluetooth headset, with high testing efficiency. The batch test method comprises the following steps of: controlling the PCBA of the Bluetooth headset and test equipment to establish a communication connection through a test computer internally provided with an automatic test control program; testing the PCBA of the Bluetooth headset by automatic control test equipment of the test computer and outputting a test result; and automatically displaying the test computer on a display. The invention also discloses a batch test system of the PCBA of the Bluetooth headset. The invention can be used for batch test of the PCBA of the Bluetooth headset.

Description

technical field [0001] The invention relates to a bluetooth earphone, in particular to a method and system for batch testing a bluetooth earphone PCBA. Background technique [0002] The production of Bluetooth headsets, the test of PCBA (Printed Circuit Board+Assembly) is very important, it is the core of the production of Bluetooth headsets, including radio frequency (RF) testing, audio (audio) testing, direct current (DC) testing and Bluetooth Address writing and data tracking, etc. Because the existing Bluetooth headset PCBA test equipment is relatively expensive, and there is no test equipment to test all the above items, more importantly, the current Bluetooth headset PCBA test time is very long, and the same test items need to be manually tested on the test equipment. Setting configuration and operation, for example: when the test device establishes a communication link with the Bluetooth headset, it is necessary to operate the test device to search for the Bluetooth ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/01
Inventor 向开术
Owner GUANGZHOU LIWEI ELECTRONICS
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