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Assembling device and assembling method of FPD component

An assembly device and assembly method technology, applied in the direction of identification devices, instruments, etc., can solve the problems of not being able to improve production efficiency, and achieve the effect of preventing thermal deterioration

Inactive Publication Date: 2011-08-03
HITACHI HIGH-TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, there is a problem that the production efficiency cannot be improved

Method used

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  • Assembling device and assembling method of FPD component
  • Assembling device and assembling method of FPD component
  • Assembling device and assembling method of FPD component

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment

[0107] Next, refer to Figure 9 A second embodiment of the FPD module assembly device of the present invention will be described.

[0108] Figure 9 It is a front view showing the cooling state of the heat shield plate of the final crimping part according to the second embodiment of the present invention.

[0109] The second embodiment of the present invention has the same structure as the FPD module assembly line 10 of the first embodiment. The difference between the second embodiment of the present invention and the FPD module assembly line 10 of the first embodiment is that scrolls are provided in the TAB-side thermal insulation mechanism and the substrate-side thermal insulation mechanism.

[0110] like Figure 9 As shown, the TAB-side thermal insulation mechanism 350A and the substrate-side thermal insulation mechanism 350B of the second embodiment of the present invention have a scroll 344 on the rear side of the nozzle 342 in order to enhance cooling of the thermal i...

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Abstract

The invention provides an assembling device and an assembling method of a FPD component, wherein even if an ACF is pre-pasted on two sides of a TAB in the length direction, the hardening of an ACF on the other side can be prevented when one side is formally pressed. The assembly line for the FPD component comprises: an ACF pasting part, a pressing head (330), and a TAB-side heat insulating mechanism (340A). The ACF pasting part pastes a first ACF layer (3a1) on one side of the TAB (2) in the length direction, and pastes a second ACF layer (3a2) on the other side of the TAB (2) in the length direction. The pressing head (330) thermally presses the TAB (2) on a display substrate (1) with an interval of the first ACF layer (3a1). The TAB-side heat insulating mechanism (340A) protects the second ACF layer (3a2) of the TAB (2) from being affected by heat when the TAB (2) is thermally pressed on the display substrate (1).

Description

technical field [0001] The present invention relates to an FPD module assembling device and an FPD module assembling method for mounting mounting components on a display substrate of a flat panel display (FPD). Background technique [0002] The FPD includes, for example, a liquid crystal display, an organic EL (Electro-Luminescence: electroluminescent) display, a plasma display, and the like. On the peripheral portion of the display substrate of the FPD, the installation of the driver IC, COF (Chip on Film: a component that uses a flexible circuit board as a packaged chip carrier to bond and connect the chip to the flexible circuit board circuit), FPC ( Flexible Printed Circuit: TAB (Tape Automated Bonding: tape-and-reel automatic die bonding technology, that is, anisotropic conductive adhesive connection method) connection such as Flexible Printed Circuit. In addition, a peripheral substrate such as a PCB (Printed Circuit Board: printed wiring board), for example, is mount...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G09F9/30
Inventor 大录范行斧城淳加藤治芳油田国夫杉崎真二野本秀树
Owner HITACHI HIGH-TECH CORP
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