Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Substrate-inspecting device having cleaning mechanism for tips of pins

A substrate inspection and cleaning mechanism technology, which is applied to the cleaning method using tools, measuring devices, cleaning methods, and tools, can solve the problems of uneven cleaning levels at the top of pins, long total time, etc., and achieve good efficiency.

Active Publication Date: 2011-06-15
NIDEC-READ CORPORATION
View PDF4 Cites 3 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, when inspecting multiple boards, the board inspection is interrupted by the cleaning operation, so the total time until the inspection of all boards is completed becomes very long
In addition, there are problems caused by uneven cleaning level of the tip end of the pin due to manual work, and detachment and attachment of inspection jigs, etc.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Substrate-inspecting device having cleaning mechanism for tips of pins
  • Substrate-inspecting device having cleaning mechanism for tips of pins
  • Substrate-inspecting device having cleaning mechanism for tips of pins

Examples

Experimental program
Comparison scheme
Effect test

other Embodiment approach

[0108] [Outline of Rotary Table Devices in Other Embodiments]

[0109] Figure 7 is viewed from above with figure 2 A plan view of a turntable device 220 according to another embodiment. for with figure 2 The same elements of the turntable device 22 are denoted by the same reference numerals, and description thereof will be omitted.

[0110] and figure 2 is different from the rotary table device 22, in place of the cleaning mechanism 50 at the position C1 on the circular table 22t between the inspection target substrate holding unit 40 at the position P2 and the inspection target substrate holding unit 40 at the position P3, along the In the radial direction, an upper pin tip end cleaning member 44Ru is provided. Therefore, the pin tip cleaning member 44Ru moves along the same path as the above-mentioned transport path on which the substrate 42 to be inspected is transported, integrally with the turntable 22 device. In addition, this installation position is arbitrary...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In a process in which a plurality of substrates are successively inspected, the tips of pins are cleaned without interrupting the flow of substrate inspection. A substrate-inspecting device (10, 70) comprises holders (40) for substrates to be inspected provided along the conveying path at predetermined intervals, and a moving means (22t) for moving the holders along the conveying path, an inspecting section (30) that is provided at a position along the conveying path and successively inspects the substrates to be inspected held by the holders of the conveying means, a cleaning means (50) provided between any adjacent holders from among the holders provided along the conveying path at the predetermined intervals. The inspecting section brings the pins into contact with inspection points in wiring on the substrates to be inspected and measures the electric characteristics of the wiring. The cleaning means is moved by the moving means of the conveying means, and cleans the pins when the cleaning means passes through the inspecting section.

Description

technical field [0001] The present invention relates to a substrate inspection device for measuring the electrical characteristics of a wiring (or conductor pattern) of a substrate to be inspected by bringing a pin into contact with an inspection point of the wiring. In the substrate inspection device of the present invention, the cleaning mechanism of the tip end of the pin can clean the tip end of the pin without affecting the measurement of the electrical characteristics. Background technique [0002] In the substrate inspection device, an inspection jig embedded with multiple pins (also called "probes") is brought close to multiple inspection points of the wiring of the substrate to be inspected, and the electrical characteristics (such as resistance value) of the wiring are measured. The term "substrate to be inspected" used in this application document includes packaging substrates for semiconductor packaging, carrier films, printed wiring boards, flexible substrates, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01R1/073G01R31/26
CPCG01R3/00B08B1/008H01R43/002H01L21/67028B08B1/30G01R31/28G01R1/073
Inventor 沼田清生野裕仁广部幸祐末满敦山本正美平井健介
Owner NIDEC-READ CORPORATION
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com