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Wafer conveying tray and method of securing wafer on tray

A fixing method and wafer technology, which are applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of troublesome fixing wafer S, deterioration of cooling efficiency, unreliable fixing stability, etc., and achieve the effect of easy temperature control.

Active Publication Date: 2011-05-18
ULVAC INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of this method, there are problems that fixing the wafer S becomes troublesome, the stability of the fixing is not reliable, and the cooling efficiency deteriorates.

Method used

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  • Wafer conveying tray and method of securing wafer on tray
  • Wafer conveying tray and method of securing wafer on tray
  • Wafer conveying tray and method of securing wafer on tray

Examples

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Embodiment Construction

[0040] According to an embodiment of the wafer transfer tray of the present invention, there can be provided a wafer transfer tray including a base made of an insulator, and an electrostatic adsorption electrode made of a conductor embedded in the base, wherein the electrostatic adsorption electrode The terminal of the power supply part is a spring-type terminal. The spring-type terminal is configured so that the front end of the spring-type terminal can contact the electrostatic adsorption electrode through the passage in the tray support table on which the tray is placed, and the wafer can be fixed to the tray by electrostatic adsorption when the power is turned on. Above, a sealing member is provided around the power supply portion in such a way that the temperature exchange medium does not spread to the contact portion between the front end portion of the spring type terminal and the electrostatic adsorption electrode, and the electrostatic adsorption that fixes the wafer to...

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PUM

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Abstract

A wafer conveying tray, wherein temperature control of a wafer is possible at the time of processing, and wherein the wafer can be easily secured without reducing the effective area in the wafer surface and without requiring the labor of attaching the wafer and post-processing. The wafer conveying tray (302) comprises a base formed from an insulator and an electrostatic chuck electrode (306) buried in the base. The terminal of the portion feeding power to the electrostatic chuck electrode is a spring-type terminal (305a), the spring-type terminal is formed so that the tip portion thereof can be brought into contact with the electrostatic chuck electrode, a seal member (305b) is provided near the power feeding portion and is formed so that a temperature exchanging medium does not reach the area where the tip portion of the spring-type terminal contacts the electrostatic chuck electrode, and the wafer (S) can be secured onto the tray by means of the electrostatic chuck. Further, a method of securing a wafer onto this wafer conveying tray by means of the electrostatic chuck is provided.

Description

technical field [0001] The present invention relates to a wafer transfer tray and a method of fixing a wafer on the tray, and more particularly to a wafer transfer tray embedded with electrostatic adsorption electrodes and a method of electrostatically fixing a wafer on the tray. Background technique [0002] Conventionally, when a plurality of wafers etc. are collectively processed by plasma processing in the manufacture of a semiconductor device, a wafer transfer tray is generally used. At this time, the plasma treatment is performed only by placing a wafer or the like on a tray, or fixing it with a pressing tool, or bonding with a thin plate, tape, grease, or the like. [0003] For example, it is known that in the manufacture of semiconductor devices and liquid crystal devices, in order to process a plurality of wafers at a time, the wafers, etc. are fixed on the transport tray using a pressing unit, and the transport tray is composed of a protective substrate and a semic...

Claims

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Application Information

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IPC IPC(8): H01L21/683
CPCH01L21/67248H01L21/683H01L21/67109H01L21/6831
Inventor 上村隆一郎渡边一弘桥本龙司
Owner ULVAC INC
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