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Multi-module packaged component

A packaging component, multi-module technology, applied in electrical components, electric solid devices, semiconductor devices, etc., can solve problems such as low packaging efficiency, and achieve the effects of improving packaging efficiency, reducing packaging times, and improving integration.

Inactive Publication Date: 2011-05-18
SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, the existing 3D-MCM packaging modules are packaged in a single module, so the packaging efficiency is usually lower than 80%

Method used

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Examples

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Embodiment Construction

[0020] The present invention will be further described below in conjunction with the accompanying drawings and embodiments, wherein the positional relationship of "up" and "down" described in this specification is related to the attached figure 1 Corresponds to the upper and lower positional relationships shown in .

[0021] See attached figure 1 And attached figure 2 As shown, a multi-module package assembly, which includes:

[0022] The first sub-module 1, the first sub-module 1 includes a first substrate 3, the first substrate 3 is a low temperature co-fired ceramic substrate, and the center of the first substrate 3 is recessed inward to form a cavity, Both sides of the first substrate 3 are mounted with chips 5, and the edge of the first substrate 3 is provided with a ball grid array pad 6;

[0023] The second sub-module 2, the second sub-module 2 includes a second substrate 4, chips 5 are mounted on both sides of the second substrate 4, and the second substrate 4 is a...

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Abstract

The invention relates to a multi-module packaged component, which comprises at least one first sub-module, a second sub-module and a second substrate, wherein the first sub-module comprises a first substrate, the at least side surface of the first substrate is adhered with a chip, and one side surface of the first substrate has a ball grid array welding area; the second sub-module comprises a second substrate, and at least one side surface of the second substrate is adhered with a chip; one side surface of the second substrate is provided with an external output pin; the first sub-module is stacked on the other side surface of the second sub-module longitudinally, and the other side surface of the second substrate also has a ball grid array welding area; and the first sub-module and the second sub-module are in physical and signal connection through a ball grid array welding process. In the invention, a plurality of sub-modules are combined by the ball grid array welding process, so the reliable packaged of multiple modules is realized; therefore, packaging times are reduced, packaging efficiency of the packaged component is improved, and the integration level of the packaged component is improved.

Description

technical field [0001] The invention relates to a multi-module packaging assembly with a 3D-MCM packaging structure. Background technique [0002] 3D-MCM (three-dimensional multi-chip component) is an advanced multi-chip component technology developed on the basis of 2D-MCM (two-dimensional multi-chip component) technology. 3D-MCM is a three-dimensional (x, y, z direction) structural form for A technology for three-dimensional integration of IC chips. There are three main methods of existing 3D-MCM packaging technology: 1) Embedded type: the internal resistance and capacitance of the components embedded in the multilayer wiring substrate can generally be embedded in the multilayer substrate with the thick film method along with the multilayer wiring. The IC chip is attached to the surface of the substrate. Or first slot the substrate, embed the IC, fix it with epoxy resin and make it flush with the surface of the substrate, then implement multi-layer wiring, and then insta...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/00H01L25/065
CPCH01L2924/15312H01L2924/16152H01L2924/1627
Inventor 周冬莲胡红光杜松张宪起
Owner SUZHOU R&D CENT OF NO 214 RES INST OF CHINA NORTH IND GRP
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