Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Electronic system multi-goal reliability allowance design method based on EDA technology

An electronic system and design method technology, applied in the field of electronics, can solve the problems of large fluctuation of system quality characteristics, no improvement in quality characteristics, and only concerned about product stability and consistency.

Inactive Publication Date: 2011-03-09
HARBIN INST OF TECH
View PDF0 Cites 46 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional reliability tolerance design only cares about the stability and consistency of product output. Although it can effectively solve the problem of large fluctuations in system quality characteristics, it has not analyzed and designed the reliability and life of the system itself, and the quality characteristics have no Improvement, so it cannot meet the needs of the current product quality design

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electronic system multi-goal reliability allowance design method based on EDA technology
  • Electronic system multi-goal reliability allowance design method based on EDA technology
  • Electronic system multi-goal reliability allowance design method based on EDA technology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Example 1: Combining figure 1 , the present invention is based on the electronic system multi-objective reliability tolerance design method of EDA technology, and the steps are as follows:

[0017] Step 1: Establish a Pspice simulation model of the electronic system, and use reliability analysis methods such as reliability modeling and reliability prediction, failure mode and effect analysis, and fault tree analysis to find key components that affect electronic system failures;

[0018] Step 2: Establish the reliability degradation model of key components according to the environmental conditions of the electronic system and the stress loads on the components;

[0019] Step 3: According to the degradation model analysis of components, find the key stress factors that affect the life of key components, and use them as the objective function of multi-objective tolerance design, according to the reliability index of the system or according to the actual stress of the compo...

Embodiment 2

[0024] Example 2: Combining figure 1 , the present invention is based on the electronic system multi-objective reliability tolerance design method of EDA technology and comprises the following steps:

[0025] Step 1: Find the key components that affect the failure of the electronic system. Use reliability modeling and prediction, failure mode and effect analysis (FMEA) and fault tree analysis (FTA) methods to analyze the reliability of the system, and determine the key components that affect the reliability of the system. Assume that the object analyzed by the multi-objective tolerance design method is an electronic system S, which is composed of n components connected to each other and has no redundant structure. When any component fails, the system cannot work normally.

[0026] (1) Establish a reliability block diagram model, which is a pure series model. It can be known that the basic reliability mathematical model of the system is:

[0027] λ ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides an electronic system multi-goal reliability allowance design method based on EDA technology. The method comprises the following steps: building the Pspice simulation model of electronic system; building key element reliability regression model according to the environment condition of the electronic system; confirming the constraint condition according to the reliability index of the system or the actual stress of the element; analyzing the sensitivity of the goal function to find the sensitive element which influences the goal function; building the regression equation between the goal function and the parameter allowance through multiple linear regression analysis to find all allowance combinations which meet the characteristic index; and building the multi-goal allowance optimization function based on mass loss. The invention controls the allowance of the sensitive element, reduces the fluctuation of the element stress caused by parameter and noise error; and the service life of each element in the system is improved without changing the system parameter and structure, thereby improving the reliability of the electronic system and prolonging the service life.

Description

(1) Technical field [0001] The invention relates to electronic technology, in particular to an electronic system multi-objective reliability tolerance design method based on EDA technology. (2) Background technology [0002] With the rapid development of modern science and technology industry, the reliability design of the system has become an indispensable part of the product quality design, and in the process of the three design (system design, parameter design and tolerance design) of the product, the tolerance design It is an important method to further improve product quality and reduce its sensitivity to design parameters and noise deviations. The parameter values ​​of electronic system components will fluctuate under the influence of various factors in actual work, mainly including the following situations: (1) Due to the manufacturing process, the parameters of the components that make up the system are usually lower than the nominal value There is a certain deviati...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 翟国富周月阁邵雪瑾谭榕容叶雪荣李享胡方
Owner HARBIN INST OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products