Lower polishing disk of polishing machine

Abstract

The invention relates to the structure of a silicon wafer lapping machine or a polishing machine, in particular to the structure of a lower polishing disk of a silicon wafer lapping machine or a polishing machine. The lower polishing disk of a polishing machine comprises a lower disk working disk (7), and is mainly characterized by also comprising a lower disk base disk (9) on the lower part of the lower disk working disk (7), wherein a cooling cavity (3) is formed between the lower disk base disk (9) and the lower disk working disk (7); the lower disk base disk (9) is provided with a water inlet (8) and a water outlet (5); and the water inlet (8) and the water outlet (5) are respectively communicated with the cooling cavity (3). The invention has the advantages that the special structure of a water cooling disk can prevent cooling water taking a shortcut; because cooling water can flow out from the water outlet (5) only after the cooling cavity (3) is filled, a polishing disk can be fully cooled by cooling water; and because heat generated by operating is carried out in time, the polishing disk can be forcibly cooled. Compared with a traditional passive cooling method, the invention is more reliable. The lower polishing disk is combined with a precise temperature measuring system and a cooling water flow regulating system to realize the precise control of polishing temperature.

Description

Technical field: [0001] The invention relates to the structure of a silicon wafer grinding machine or polishing machine, in particular to the structure of a polishing disc under the silicon wafer grinding machine or polishing machine. Background technique: [0002] The lower polishing disc used in the silicon wafer polishing machine will generate a lot of heat during the polishing process, and the temperature change will inevitably cause the deformation of the polishing disc, which will affect the processing quality, so the temperature of the polishing disc must be strictly controlled. In recent years, the size of silicon wafers for IC chips tends to be larger in diameter, and the quality requirements for silicon wafers are becoming more and more stringent. For polishing equipment used for double-sided polishing of silicon wafers, the deformation of the throwing plate must be strictly controlled. [0003] The throwing plate of the double-sided polishing machine produced befo...

AI Technical Summary

Problems solved by technology

[0003] The throwing plate of the double-sided polishing machine produced before adopts an integral structure without a special temperature control device. The heat generated during the polishing process is mainly taken away by the polishing liquid, which belongs to passive cooling, and the change of the throwing plate temperature is uncontrollable.

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