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Epoxy resin composition containing isocyanurates for use in electrical laminates

A technology of resin composition and isocyanurate, which is applied in the direction of printed circuit, electrical components, etc., can solve the problem of low decomposition temperature of resin

Inactive Publication Date: 2010-12-08
DOW GLOBAL TECH LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The presence of oxazolidinones enables a higher glass transition temperature, but has the disadvantage of a lower decomposition temperature for the cured resin

Method used

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  • Epoxy resin composition containing isocyanurates for use in electrical laminates
  • Epoxy resin composition containing isocyanurates for use in electrical laminates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0111] will be fitted with a mechanical stirrer, addition funnel, condenser, N 2 A five-necked 1-liter glass reactor with inlet, thermometer, and heating jacket assembled into a fully vented enclosure. Ejectors of compressed air are provided so that cooling can be applied in case of excessive temperature or uncontrolled conditions. The reactor was charged with 170 g of bisphenol-A diglycidyl ether (D.E.R. TM 383, available from The Dow Chemical Co., Midland, Michigan, has an epoxy equivalent weight (EEW) of 180 g / eq, and a density of 1.20 g / cc) and 60 mg of 2-phenylimidazole (catalyst). After heating to 130°C, a 10 g portion of toluene diisocyanate (TDI, with a ratio of 2,4 / 2,6 isomers of about 80 / 20) was added to the reaction at 130-135°C for 10 minutes In the container, keep for 10 minutes. A second 10 g portion of TDI was then added over 9 minutes followed by a further 10 minutes hold. A final 10 g portion of TDI was then added over 7 minutes followed by a 5 minute wai...

Embodiment 2

[0115] The apparatus described in Example 1 was filled with 187 g of bisphenol-A diglycidyl ether (D.E.R. TM 383, available from The Dow Chemical Co., has an epoxy equivalent weight (EEW) of 180 g / eq) and 66 mg of 2-phenylimidazole. After heating to 130°C, a 10 g portion of toluene diisocyanate (TDI, with a ratio of 2,4 / 2,6 isomers of about 80 / 20) was added to the reactor at 130-135°C for 6 minutes , then hold for 7 minutes. A second 10 g portion of TDI was then added over 10 minutes followed by a further 8 minutes hold. A final 10 g portion of TDI was then added over 8 minutes followed by an 8 minute wait. The temperature was then raised to 140-145°C over 5 minutes and held for 30 minutes, then raised to 150-155°C over 5 minutes and held for 30 minutes before allowing the reactor contents to cool.

[0116] During the cooling process, the residual isocyanate level was passed through FT-IR (due to the -1 isocyanate spike) measurement. EEW of 238 g / eq, and molar ratio of o...

Embodiment 3

[0118] The apparatus described in Example 1 was filled with 170 g of bisphenol-A diglycidyl ether (D.E.R. TM 383, available from The Dow Chemical Co., has an epoxy equivalent weight (EEW) of 180 g / eq) and 60 mg of 2-phenylimidazole. After heating to 130°C, a 10 g portion of toluene diisocyanate (TDI, with a ratio of 2,4 / 2,6 isomers of about 80 / 20) was added to the reactor at 130-135°C for 10 minutes , then hold for 11 minutes. The reaction was then heated to 140-145°C and a second 10 g portion of TDI was added over 13 minutes followed by an additional 9 minute hold. A final 10 g portion of TDI was then added over 10 minutes followed by a 5 minute hold. The temperature was then raised to 150-155°C over 5 minutes and held for 30 minutes before allowing the reactor contents to cool.

[0119] During the cooling process, the residual isocyanate level was passed through FT-IR (due to the -1 isocyanate spike) measurement. EEW of 264 g / eq, and molar ratio of oxazolidinone to iso...

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Abstract

A resin composition comprising oligomers having a molar ratio of isocyanurate to oxazolidinone greater than 1 :1, wherein the weight average molecular weight of the oligomers is less than or equal to 3000, as measured by gel permeation chromatography. Such resin compositions may be combined with a hardener to form a curable composition. Also disclosed is a process for forming a resin composition, including: reacting diisocyanates to form isocyanurates; reacting isocyanate groups in the isocyanurates and unreacted diisocyanates with an epoxy precursor to form a resin composition comprising oligomers having: a molar ratio of isocyanurate to oxazolidinone greater than 1 :1; wherein the weight average molecular weight of the oligomers is less than or equal to 3000, as measured by gel permeation chromatography. Such compositions may be useful in prepregs and laminates.

Description

technical field [0001] Embodiments disclosed herein relate generally to isocyanurate-epoxy formulations. More specifically, embodiments disclosed herein relate to isocyanurate-epoxy formulations having high glass transition temperatures and high decomposition temperatures. Background technique [0002] Resins used in electrical laminate applications often require a good balance of properties. For example, resins with low viscosity can reduce problems with voids, poor fiber wetting, poor prepreg appearance, and other problems. Also desirable are resins with high glass transition temperatures. [0003] With the advent of lead-free solders for printed circuit boards, the requirements for the dimensional stability of circuit boards have increased, especially due to the higher melting point of typical lead-free solders. A particular problem encountered when producing boards with lead-free solder is the thermal expansion of the board in the z-axis (perpendicular to the normal p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/00C08G18/02C08G18/08C08G18/09C08G18/78C08G18/79C08G59/40
CPCC08G18/7881H05K1/0326C08G18/791C08G59/4028C08L63/00C08G59/3236C08G18/584
Inventor 廖增琨迈克尔·J·马林斯罗伯特·L·赫恩欧内斯托·E·奥奇洛约瑟夫·甘
Owner DOW GLOBAL TECH LLC
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